Title:
HOT-MELT ADHESIVE AND FILTER ASSEMBLED USING SAID ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2021/112124
Kind Code:
A1
Abstract:
This adhesive is a hot-melt adhesive satisfying the following conditions (A), (B), and (C). (A) Conformance to ASTM D3236-73, and the melting viscosity measured at 190℃ using a No. SC4-27 spindle is 1,000-15,000 mPa·s. (B) Conformance to JIS K6863-1994, and the softening point measured using silicone oil as a heat medium is 130-170℃. (C) Conformance to JIS K7196-1991, and when a cylindrical detection rod with a diameter of 3 mm is set on a specimen cut out in a 5-mm square from a sample sheet molded at a thickness of 2 mm, nitrogen gas is flowed over the specimen at a rate of 100 ml/min, a load of 10 gf is applied to the specimen, and the temperature of the specimen is ramped up at a speed of 5℃/min, the specimen softens and displacement thereof in the contraction direction reaches 0.05 mm at a temperature of at least 90℃.
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Inventors:
SUTOU MASAHIRO (JP)
Application Number:
PCT/JP2020/044853
Publication Date:
June 10, 2021
Filing Date:
December 02, 2020
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C09J11/06; B01D46/52; C09J123/00; C09J123/12; C09J201/00
Foreign References:
| JP2000226561A | 2000-08-15 | |||
| JPH04236288A | 1992-08-25 | |||
| JPH0747211A | 1995-02-21 | |||
| JP2002309206A | 2002-10-23 | |||
| JPH10272329A | 1998-10-13 |
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