Title:
HOT-MELT ADHESIVE FOR POSITIONING ABSORBENT ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/210453
Kind Code:
A1
Abstract:
The present invention provides a hot-melt adhesive for positioning an absorbent article, the hot-melt adhesive containing a styrene-based block copolymer (A), a tackifying resin (B), a wax (C), and a liquid plasticizer (D), wherein: the styrene-based block copolymer (A) contains a styrene-based block copolymer (A1) and a styrene-based block copolymer (A2); the styrene-based block copolymer (A1) is a styrene-isoprene-styrene block copolymer (SIS) and/or a styrene-butadiene-styrene block copolymer (SBS); in both of said copolymers, the styrene content is 40-50 mass% and the diblock content is less than 1 mass%; the styrene-based block copolymer (A2) is an SIS and/or an SBS; in both of said copolymers, the styrene content is 30-39 mass% and the diblock content is 55-75 mass%; and the wax (C) content is 1-40 parts by mass relative to 100 parts by mass of the styrene-based block copolymer (A).
Inventors:
NAGATOMO KAZUKI (JP)
SUGIMOTO TETSUYASU (JP)
SUGIMOTO TETSUYASU (JP)
Application Number:
PCT/JP2023/015537
Publication Date:
November 02, 2023
Filing Date:
April 19, 2023
Export Citation:
Assignee:
SEKISUI FULLER CO LTD (JP)
International Classes:
C09J11/08; C09J153/02; C09J191/06
Foreign References:
| JP2018517581A | 2018-07-05 | |||
| JP2018514604A | 2018-06-07 | |||
| JP2016153448A | 2016-08-25 | |||
| JP2021509425A | 2021-03-25 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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