Title:
HOT MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2019/003964
Kind Code:
A1
Abstract:
Disclosed is a hot melt adhesive comprising: (A) a metallocene based propylene homopolymer, (B) a metallocene based ethylene/α-olefin copolymer, (C) a tackifier resin, and (D) a plasticizer, wherein the plasticizer (D) comprises (D1) an oil and (D2) at least one polymer selected from polybutene, polybutadiene, polyisobutylene, and polyisoprene. This hot melt adhesive has an initial adhesive strength enough to enable a pressure sensitive adhesion body to stick easily on a member, thus making it possible to firmly hold the pressure sensitive adhesion body on the member. The hot melt adhesive is also excellent in releasability, thus causing no adhesive residue on the member when the pressure sensitive adhesion body is peeled from the member.
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Inventors:
KAKUDA ATSUSHI (JP)
MAEDA NAOHIRO (JP)
MAEDA NAOHIRO (JP)
Application Number:
PCT/JP2018/022947
Publication Date:
January 03, 2019
Filing Date:
June 15, 2018
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
International Classes:
C09J123/08; C08K5/01; C08L9/00; C08L23/12; C08L23/22
Domestic Patent References:
| WO2013039261A1 | 2013-03-21 | |||
| WO2016167931A1 | 2016-10-20 |
Foreign References:
| JP2013064055A | 2013-04-11 | |||
| JP2014208812A | 2014-11-06 | |||
| JP2016524002A | 2016-08-12 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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