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Patent Searching and Data


Title:
HOT STAMP MOULDED BODY
Document Type and Number:
WIPO Patent Application WO/2018/151330
Kind Code:
A1
Abstract:
Provided is a hot stamp moulded body which is characterized by: including a plate thickness central portion, and a surface layer provided to one or both sides of the plate thickness central portion; and further including intermediate layers formed next to and between the plate thickness central portion and the respective surface layers. The hot stamp moulded body is further characterized in that: the plate thickness central portion has a prescribed composition; the hardness of the plate thickness central portion is at least 500 Hv, but not more than 800 Hv; the variation ΔH1 in hardness in the surface layers in the plate thickness direction is at least 10 Hv, but less than 200 Hv; and the variation ΔH2 in hardness in the intermediate layers in the plate thickness direction is at least 50 Hv, but less than 200 Hv.

Inventors:
TODA YURI (JP)
ABUKAWA GENKI (JP)
MAEDA DAISUKE (JP)
HIKIDA KAZUO (JP)
FUJINAKA SHINGO (JP)
Application Number:
PCT/JP2018/006078
Publication Date:
August 23, 2018
Filing Date:
February 20, 2018
Export Citation:
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Assignee:
NIPPON STEEL & SUMITOMO METAL CORP (JP)
International Classes:
C22C38/00; C22C38/60; B21D22/20; B21D22/26; C21D1/18; C21D9/00; C21D9/46
Domestic Patent References:
WO2014024831A12014-02-13
WO2012128225A12012-09-27
WO2015152284A12015-10-08
WO2014034714A12014-03-06
WO2013180180A12013-12-05
WO2015097882A12015-07-02
Foreign References:
JP2014201765A2014-10-27
JP2015196844A2015-11-09
JP2015030890A2015-02-16
JP2006104546A2006-04-20
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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