Title:
HOT STAMP MOULDED BODY
Document Type and Number:
WIPO Patent Application WO/2018/151333
Kind Code:
A1
Abstract:
The present invention provides a hot stamp moulded body which exhibits excellent bendability, ductility, impact resistance characteristics, and hydrogen embrittlement resistance characteristics, and has little variation in hardness. A hot stamp moulded body according to the present invention is characterized by being provided with a plate thickness central portion, and a softened layer provided to one or both sides of the plate thickness central portion. The hot stamp moulded body is further characterized in that: the plate thickness central portion has a hardness in the range of 500-800 Hv inclusive; and, in the metal structure from a depth of 20 µm below the surface of the softened layer to a depth of ½ of the thickness of the softened layer, when areas surrounded by grain boundaries having a misorientation of 15˚ or higher, in a cross section parallel to the plate thickness direction, are defined as crystal grains, the total area ratio of crystal grains having a maximum crystal misorientation of 1˚ or lower inside the crystal grains defined above, and crystal grains having a maximum crystal misorientation in the range of 8-15˚ inclusive inside the crystal grains defined above is at least 20%, but less than 50%.
Inventors:
TODA YURI (JP)
ABUKAWA GENKI (JP)
MAEDA DAISUKE (JP)
HIKIDA KAZUO (JP)
ABUKAWA GENKI (JP)
MAEDA DAISUKE (JP)
HIKIDA KAZUO (JP)
Application Number:
PCT/JP2018/006087
Publication Date:
August 23, 2018
Filing Date:
February 20, 2018
Export Citation:
Assignee:
NIPPON STEEL & SUMITOMO METAL CORP (JP)
International Classes:
C22C38/00; B21D22/20; C22C38/60; C21D1/18; C21D9/00; C21D9/46
Domestic Patent References:
| WO2015194571A1 | 2015-12-23 | |||
| WO2014024831A1 | 2014-02-13 | |||
| WO2015099382A1 | 2015-07-02 | |||
| WO2015097882A1 | 2015-07-02 |
Foreign References:
| JP2015030890A | 2015-02-16 | |||
| JP2015030890A | 2015-02-16 | |||
| JP2006104546A | 2006-04-20 |
Other References:
See also references of EP 3584338A4
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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