Title:
HOUSING ASSEMBLY AND ELECTRONIC DEVICES
Document Type and Number:
WIPO Patent Application WO/2021/000718
Kind Code:
A1
Abstract:
A housing assembly (100) is provided according to the present disclosure. The housing assembly (100) includes a dielectric substrate (110) and a radio-wave transparent structure (120). The dielectric substrate (110) has a first transmittance for a radio frequency signal in a preset frequency band. The radio-wave transparent structure (120) is disposed on the dielectric substrate (110) and at least partially covers the dielectric substrate (110). A region of the housing assembly (100) corresponding to the radio-wave transparent structure (120) has a second transmittance for the radio frequency signal in the preset frequency band, and the second transmittance is larger than the first transmittance. The housing assembly (100) can be applied to an electronic device (1) having an antenna module (220).
Inventors:
JIA YUHU (CN)
Application Number:
PCT/CN2020/095944
Publication Date:
January 07, 2021
Filing Date:
June 12, 2020
Export Citation:
Assignee:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
International Classes:
H01Q15/08
Domestic Patent References:
| WO2014197328A1 | 2014-12-11 |
Foreign References:
| CN103367903A | 2013-10-23 | |||
| CN103367912A | 2013-10-23 | |||
| CN109642938A | 2019-04-16 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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