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Title:
HOUSING ASSEMBLY AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/095579
Kind Code:
A1
Abstract:
Provided are a housing assembly and a manufacturing method therefor, and an electronic device. The housing assembly comprises: a first substrate, the first substrate having a first surface; and a second substrate, the second substrate having a second surface, at least part of the second surface being attached to at least part of the first surface by means of a porous ceramic layer, the porous ceramic layer having an aperture, and a portion of the second substrate being embedded into part of the aperture.

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Inventors:
LI CONG (CN)
Application Number:
PCT/CN2021/116722
Publication Date:
May 12, 2022
Filing Date:
September 06, 2021
Export Citation:
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Assignee:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
International Classes:
C04B41/87; B24B29/00; B28B19/00; B29C45/77; B29C45/78; C04B35/10; C04B35/48; C04B35/622; C04B35/64; C04B38/06; H05K5/02
Foreign References:
CN110653993A2020-01-07
CN109023497A2018-12-18
CN206452626U2017-08-29
CN105992478A2016-10-05
CN102724840A2012-10-10
CN110016633A2019-07-16
CN109093926A2018-12-28
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
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