Title:
HOUSING FOR ELECTRONIC CONTROL UNIT, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/181125
Kind Code:
A1
Abstract:
[Problem] To provide a housing for an electronic control unit and a method for manufacturing the same, the housing capable of alleviating stress due to a thermal expansion difference between the housing composed of a resin and a heat sink. [Solution] The present invention relates to a housing 1 for an electronic control unit capable of accommodating the electronic control unit and a method for manufacturing the same, the housing comprising: a tray 4 that has a recessed section 42 that can accommodate the electronic control unit, and is constituted mainly by a resin; and a lid body 2 that engages with the tray 4 so as to cover the recessed section 42, wherein the lid body 2 comprises: a heat sink 10 that has heat dissipation fins 12; a lid body housing 20 that is mainly constituted by a resin, engages with the tray 4, and surrounds the outer periphery of the heat sink 10 so that the heat dissipation fins 12 are exposed on the side opposite to the recessed section 42; and a seal member 30 that is constituted by a rubber elastic body and is disposed between the heat sink 10 and the lid body housing 20.
Inventors:
NOZAKI TOMOHIRO (JP)
NAKAYA ATSUSHI (JP)
NAKAYA ATSUSHI (JP)
Application Number:
PCT/JP2022/013219
Publication Date:
September 28, 2023
Filing Date:
March 22, 2022
Export Citation:
Assignee:
SHIN ETSU POLYMER CO LTD (JP)
International Classes:
H05K7/20
Foreign References:
| JP2005533714A | 2005-11-10 | |||
| JP2020536375A | 2020-12-10 | |||
| JP2007184428A | 2007-07-19 | |||
| US20180228065A1 | 2018-08-09 | |||
| JP2008031358A | 2008-02-14 |
Attorney, Agent or Firm:
MEBUKI IP LAW FIRM et al. (JP)
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