Title:
HOUSING MATERIAL FOR POWER STORAGE DEVICE, MANUFACTURING METHOD FOR HOUSING MATERIAL, AND POWER STORAGE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/127956
Kind Code:
A1
Abstract:
Provided is a housing material for a power storage device, the housing material configured from a layered body comprising, in order from the outer side, at least an impact resistance layer, a resin film layer, a barrier layer, and a heat-fusible resin layer.
Inventors:
AKUTSU KOKI (JP)
SASAKI MIHO (JP)
SASAKI MIHO (JP)
Application Number:
PCT/JP2022/048622
Publication Date:
July 06, 2023
Filing Date:
December 28, 2022
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H01M50/129; H01G2/10; H01G11/78; H01M50/103; H01M50/105; H01M50/119; H01M50/121; H01M50/131; H01M50/14; H01M50/15; H01M50/169
Foreign References:
| JP6986184B1 | 2021-12-22 | |||
| JPH05314956A | 1993-11-26 | |||
| JP2006093101A | 2006-04-06 | |||
| JP2021177488A | 2021-11-11 |
Attorney, Agent or Firm:
TANAKA, Junya et al. (JP)
Download PDF: