Title:
HOUSING METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2012/081069
Kind Code:
A1
Abstract:
[Problem] Provided are: a housing which can be applied to an electronic device, and can make the best use of the texture of wood; and a housing production method which can accurately produce such housings. [Solution] A plurality of wood plates are bonded by an adhesive agent to form a core layer (13). Next, the core layer (13) is cut into a predetermined shape having notches. Then, the position of the core layer (13) is determined by the notches and pins (16) inserted in holes provided in a die (21) of a press molding machine, and then, the core layer (13) is arranged on the die (21). The core layer (13) is subjected to press molding to have a predetermined shape wherein the notches are closed by curving the portions around the notches, and the adhesive agent is cured to obtain a molded product. Subsequently, a decorative plate having a beautiful wood grain is adhered on the molded product.
More Like This:
Inventors:
OMOTE KOJI (JP)
KIMURA KOICHI (JP)
KIMURA KOICHI (JP)
Application Number:
PCT/JP2010/072362
Publication Date:
June 21, 2012
Filing Date:
December 13, 2010
Export Citation:
Assignee:
FUJITSU LTD (JP)
OMOTE KOJI (JP)
KIMURA KOICHI (JP)
OMOTE KOJI (JP)
KIMURA KOICHI (JP)
International Classes:
B27M3/00; B27M1/02; H05K5/02
Foreign References:
| JPS296047B1 | ||||
| JPS6135904A | 1986-02-20 | |||
| JPS55144109A | 1980-11-10 | |||
| JP2005353748A | 2005-12-22 |
Attorney, Agent or Firm:
OKAMOTO, KEIZO (JP)
Keizo Okamoto (JP)
Keizo Okamoto (JP)
Download PDF:
Claims: