Title:
HYDROPHOBIC THERMAL-CONDUCTIVE COATING FILM AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/045434
Kind Code:
A1
Abstract:
The present invention proposes a hydrophobic thermal-conductive coating film which is excellent in heat resistance and hydrophobicity while using a low-cost raw material, and a method for manufacturing the same. A hydrophobic thermal-conductive coating film according to one aspect of the present invention includes: a thermal-conductive layer including a thermal-conductive filler and an adhesive agent for improving adhesion of the thermal-conductive filler; and a hydrophobic layer formed on one surface of the thermal-conductive layer.
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Inventors:
YANG HYUN SEUNG (KR)
LEE WOO SUNG (KR)
PARK SEONG DAE (KR)
LEE WOO SUNG (KR)
PARK SEONG DAE (KR)
Application Number:
PCT/KR2018/009951
Publication Date:
March 07, 2019
Filing Date:
August 29, 2018
Export Citation:
Assignee:
KOREA ELECTRONICS TECHNOLOGY (KR)
International Classes:
C09D7/61; B01J2/30; B05D3/02; C09D201/00
Foreign References:
| KR20130011444A | 2013-01-30 | |||
| KR20140066424A | 2014-06-02 | |||
| KR940003194B1 | 1994-04-15 | |||
| CN106590219A | 2017-04-26 | |||
| KR101123394B1 | 2012-03-23 |
Attorney, Agent or Firm:
NAM, Choong Woo (KR)
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