HYDROSILYLATION CURABLE POLYORGANOSILOXANE COMPOSITION AND METHODS FOR THE PREPARATION AND USE THEREOF IN ENCAPSULATION FILMS CROSS REFERENCE TO RELATED APPLICATIONS [0001] This application claims the benefit of U.S. Provisional Patent Application Serial No. 63/229606 filed on 05 Aug 2021 under 35 U.S.C. §119 (e). U.S. Provisional Patent Application Serial No. 63/229606 is hereby incorporated by reference. FIELD [0002] A hydrosilylation curable polyorganosiloxane composition can be cured to form a silicone encapsulation film suitable for use in OLED displays. A method for preparing the composition, and a method for using the composition to prepare the silicone encapsulation film, are provided. INTRODUCTION [0003] Encapsulation films are used in organic light emitting diode (OLED) displays to protect sensitive electronic components. The encapsulation film covers humidity-sensitive electronic components, e.g., organic light emitters, to prevent oxidation, as well as to physically protect electronic components from damage caused by external forces. [0004] There is an industry need for encapsulation films with one or more of the following properties: optical transmittance, fast curability, no or minimal outgas generation, and dimensional stability. Modulus impacts dimensional stability of encapsulation films, and also the capability to stack electronic components containing the encapsulation films. In addition, dielectric constant (Dk) is a measured value of polarizability of a film. Encapsulation films with low Dk values can reduce parasitic capacitance, which is undesirable because parasitic capacitance increases electrical power consumption. Therefore, there is an industry need for materials to prepare OLED encapsulation films with both low Dk and proper modulus values. BRIEF DESCRIPTION OF THE DRAWINGS [0005] Figure 1 is a structure scheme for a component of a transparent and rigid OLED mounted to a glass substrate. Reference Numerals 100 structure scheme for a component of a transparent and rigid OLED mounted to a glass substrate Page 1 of 26

101 dam 102 CF 103 silicone encapsulation film 104 passivation (SiON) 105 TFT + WOLED 106 glass substrate SUMMARY [0006] A method for forming a silicone encapsulation film is provided. The silicone encapsulation film is suitable for use in an OLED display. The method for forming the silicone encapsulation film comprises: (1) combining starting materials comprising 50 % to 58.59%, based on combined weights of starting materials (A), (B), (C), and (D) of (A) a polydiorganosiloxane polymer comprising a linear polymer with unit formula (R ¹ ₂ R ² SiO _1/2 ) _a (R ¹ ₂ SiO _2/2 ) _b , where R ¹ is an alkyl group of 1 to 12 carbon atoms, R ² is an alkenyl group of 2 to 12 carbon atoms, subscripts a, b, and c represent average numbers of each unit per molecule and have values such that a = 2, and 100 ≤ b ≤ 300; 40 % to 48.59%, based on combined weights of starting materials (A), (B), (C), and (D) of (B) an alkenyl functional polyorganosilicate resin with unit formula (R ¹ 2R ² SiO1/2)d(R ¹ 3SiO2/2)e(SiO4/2)f(HO1/2)g, where R ¹ and R ² are as described above, subscripts e, f, g, and h represent mole fractions of each unit in the resin and have values such that d > 0, e ≥ 0, f > 0, a quantity (d + e + f) = 1, and the resin has a number average molecular weight of 1,500 g/mol to 15,000 g/mol, and subscript g > 0, with the proviso that subscript g has a value sufficient to provide the resin with a hydroxyl content of 0 to 2 weight % based on weight of the resin; 1.4 weight % to 2.5 weight %, based on combined weights of starting materials (A) to (D), of (C) a polyorganohydrogensiloxane with unit formula (R ¹ ₂ HSiO _1/2 ) _h (R ¹ ₃ SiO _1/2 ) _i (R ¹ ₂ SiO _2/2 ) _j (R ¹ HSiO _2/2 ) _k , where R ¹ is as described above, subscripts h, i, j, and k represent average numbers of each unit per molecule, 0 ≤ h ≤ 2, 0 ≤ i ≤ 2, (h + i) = 2, 0 ≤ j < 10, 0 < k < 10, 0 < (j + k) < 10, and 2 ≤ (h + k) ≤ 12; where amounts of (A) the polydiorganosiloxane polymer, (B) the alkenyl functional polyorganosilicate resin, and (C) the Page 2 of 26

polyorganohydrogensiloxane are sufficient to provide a weight ratio of silicon bonded hydrogen atoms from (C) to alkenyl groups from (A) and (B) combined (SiH/Vi ratio) of 0.30 to 0.55; and 0.01 weight % to 0.02 weight%, based on combined weights of starting materials (A) to (D), of (D) a hydrosilylation reaction catalyst comprising platinum complexed with an alkenyl- functional organosiloxane, thereby forming a hydrosilylation curable polyorganosiloxane composition; (2) molding the hydrosilylation curable polyorganosiloxane composition into a film; and (3) curing the hydrosilylation curable polyorganosiloxane composition, thereby forming the silicone encapsulation film. DETAILED DESCRIPTION [0007] Starting materials used in the method described above are described in detail below. (A) Polydiorganosiloxane Polymer [0008] Starting material (A) is a polydiorganosiloxane polymer. The polydiorganosiloxane polymer comprises (A-1) a linear polymer with unit formula (R ¹ ₂ R ² SiO _1/2 ) _a (R ¹ ₂ SiO _2/2 ) _b , where R ¹ is an alkyl group of 1 to 12 carbon atoms, R ² is an alkenyl group of 2 to 12 carbon atoms, subscripts a, b, and c represent numbers of each unit per molecule, subscript a is 2, and subscript b is 100 to 300. [0009] Suitable alkyl groups for R ¹ may be linear, branched, cyclic, or combinations of two or more thereof. The alkyl groups are exemplified by methyl, ethyl, propyl (including n-propyl and/or isopropyl), butyl (including n-butyl, tert-butyl, sec-butyl, and/or isobutyl); pentyl, hexyl, heptyl, octyl, decyl, and dodecyl (and branched isomers having 5 to 12 carbon atoms), and the alkyl groups are further exemplified by cycloalkyl groups such as cyclopropyl, cyclobutyl, cyclopentyl, and cyclohexyl. Alternatively, the alkyl group for R ¹ may be selected from the group consisting of methyl, ethyl, propyl and butyl; alternatively methyl, ethyl, and propyl; alternatively methyl and ethyl. Alternatively, the alkyl group for R ¹ may be methyl. [0010] The alkenyl group for R ² may have terminal alkenyl functionality, e.g., R ² may have formula where subscript y is 0 to 10, alternatively 0 to 6, and * denotes a point of attachment (i.e., to a silicon atom). Alternatively, each R ² may be independently selected from the group consisting of vinyl, allyl, and hexenyl. Alternatively, each R ² may be independently selected from the group consisting of vinyl and allyl. Alternatively, each R ² may be independently Page 3 of 26

selected from the group consisting of vinyl and hexenyl. Alternatively, each R ² may be vinyl. [0011] Starting material (A-1) may comprise an alkenyl-functional polydiorganosiloxane such as i) bis-dimethylvinylsiloxy-terminated polydimethylsiloxane, ii) bis-dimethylvinylsiloxy- terminated poly(dimethylsiloxane/methylvinylsiloxane), iii) bis-dimethylvinylsiloxy-terminated polymethylvinylsiloxane, iv) bis-trimethylsiloxy-terminated poly(dimethylsiloxane/methylvinylsiloxane), v) bis-trimethylsiloxy-terminated polymethylvinylsiloxane, vi) bis-dimethylhexenylsiloxy-terminated polydimethylsiloxane, vii) bis-dimethylhexenylsiloxy-terminated poly(dimethylsiloxane/methylhexenylsiloxane), viii) bis- dimethylhexenylsiloxy-terminated polymethylhexenylsiloxane, ix) bis-trimethylsiloxy-terminated poly(dimethylsiloxane/methylhexenylsiloxane), x) bis-trimethylsiloxy-terminated polymethylhexenylsiloxane, xi) bis-dimethylvinylsiloxy-terminated poly(dimethylsiloxane/methylhexenylsiloxane), xii) bis-dimethylhexenylsiloxy-terminated poly(dimethylsiloxane/methylvinylsiloxane), and xiii) a combination of two or more of i) to xii). Alternatively, starting material (A-1) may be selected from the group consisting of i) bis- dimethylvinylsiloxy-terminated polydimethylsiloxane, vi) bis-dimethylhexenylsiloxy-terminated polydimethylsiloxane, and a combination thereof. Alternatively, starting material (A) may be a bis-dimethylvinylsiloxy-terminated polydimethylsiloxane. [0012] Methods of preparing alkenyl-functional polydiorganosiloxanes described above for starting material (A-1), such as hydrolysis and condensation of the corresponding organohalosilanes and oligomers or equilibration of cyclic polydiorganosiloxanes, are known in the art, see for example U.S. Patents 3,284,406; 4,772,515; 5,169,920; 5,317,072; and 6,956,087, which disclose preparing linear polydiorganosiloxanes with alkenyl groups. Examples of linear polydiorganosiloxanes having alkenyl groups are commercially available from, e.g., Gelest Inc. of Morrisville, Pennsylvania, USA under the tradenames DMS-V00, DMS-V03, DMS-V05, DMS- V21, DMS-V6, DMS-V25, DMS-V-31, DMS-V33, DMS-V34, DMS-V35, DMS-V41, DMS- V42, DMS-V43, DMS-V46, DMS-V51, DMS-V52. [0013] Starting material (A) may optionally further comprise (A-2) a cyclic polymer with unit formula (R ¹ R ² SiO2/2)c, where R ¹ and R ² are as described above, and subscript c is 3 to 12. One skilled in the art would recognize that cyclic polymers may form as by-products in the methods to make the linear alkenyl-functional polydiorganosiloxanes described above. Examples of cyclic alkenyl-functional polydiorganosiloxanes include 2,4,6-trimethyl-2,4,6-trivinyl-cyclotrisiloxane, Page 4 of 26

2,4,6,8-tetramethyl-2,4,6,8-tetravinyl-cyclotetrasiloxane , 2,4,6,8,10-pentamethyl-2,4,6,8,10- pentavinyl-cyclopentasiloxane, and 2,4,6,8,10,12-hexamethyl-2,4,6,8,10,12-hexavinyl- cyclohexasiloxane. These cyclic alkenyl-functional polydiorganosiloxanes are known in the art and are commercially available from, e.g., Sigma-Aldrich of St. Louis, Missouri, USA; Milliken of Spartanburg, South Carolina, USA; and other vendors. The amount of starting material (A-2) may be 0 to 0.2% based on combined weights of starting materials (A) to (D). The balance of starting material (A) is starting material (A-1), described above. (B) Polyorganosilicate Resin [0014] Starting material (B) is the polyorganosilicate resin, which comprises monofunctional units of formula R ^M ₃ SiO _1/2 and tetrafunctional units (“Q” units) of formula SiO _4/2 , where each R ^M is an independently selected monovalent hydrocarbyl group selected from R ¹ and R ² , described above. Alternatively, each R ^M may be selected from methyl and vinyl and phenyl. Alternatively, at least one-third, alternatively at least two thirds of the R ^M groups are methyl groups. Alternatively, the monofunctional units may be exemplified by (Me ₃ SiO _1/2 ) and (Me ₂ ViSiO _1/2 ). The polyorganosilicate resin is soluble in solvents, exemplified by liquid hydrocarbons, such as benzene, toluene, xylene, ethyl benzene, heptane, and combinations of two or more thereof; or in liquid organosilicon compounds such as low viscosity linear and cyclic polydiorganosiloxanes. [0015] When prepared, the polyorganosilicate resin comprises the monofunctional and tetrafunctional units described above, and the polyorganosilicate resin further comprises units with silanol (silicon bonded hydroxyl) groups and may comprise neopentamer of formula Si(OSiR ^M ₃ ) ₄ , where R ^M is as described above. Si ²⁹ Nuclear Magnetic Resonance (NMR) spectroscopy, as described in U.S. Patent 9,593,209 at col.32, Reference Example 2, may be used to measure molar ratio of monofunctional and tetrafunctional units, where said ratio is expressed as {M(resin)+(M(neopentamer)}/{Q(resin)+Q(neopentamer)} and represents the molar ratio of the total number of triorganosiloxy groups (M units) of the resinous and neopentamer portions of the polyorganosilicate resin to the total number of silicate groups (Q units) in the resinous and neopentamer portions. [0016] The Mn of the polyorganosilicate resin depends on various factors including the types of hydrocarbyl groups represented by R ^M that are present. The Mn of the polyorganosilicate resin refers to the number average molecular weight measured using gel permeation chromatography (GPC) according to the procedure in U.S. Patent 9,593,209 at col.31, Reference Example 1, when Page 5 of 26

the peak representing the neopentamer is excluded from the measurement. The Mn of the polyorganosilicate resin may be 1,500 or greater, alternatively greater than 3,000 g/mol, alternatively 1,500 g/mol to 15,000 g/mol, and alternatively 3,000 g/mol to 8,000 g/mol. Alternatively, Mn of the polyorganosilicate resin may be 4,500 g/mol to 7,500 g/mol. [0017] The polyorganosilicate resin can be prepared by any suitable method, such as cohydrolysis of the corresponding silanes or by silica hydrosol capping methods. The polyorganosilicate resin may be prepared by silica hydrosol capping processes such as those disclosed in U.S. Patent 2,676,182 to Daudt, et al.; U.S. Patent 4,611,042 to Rivers-Farrell et al.; and U.S. Patent 4,774,310 to Butler, et al. The method of Daudt, et al. described above involves reacting a silica hydrosol under acidic conditions with a hydrolyzable triorganosilane such as trimethylchlorosilane, a siloxane such as hexamethyldisiloxane, or mixtures thereof, and recovering a copolymer having monofunctional units and tetrafunctional units. The resulting copolymers generally contain from 2 to 5 percent by weight of hydroxyl groups. [0018] The intermediates used to prepare the polyorganosilicate resin may be triorganosilanes and silanes with four hydrolyzable substituents or alkali metal silicates. The triorganosilanes may have formula R ¹ 3SiX ¹ , where R ¹ is as described above, and X ¹ represents a hydrolyzable substituent. Silanes with four hydrolyzable substituents may have formula SiX ² ₄ , where each X ² is halogen, alkoxy or hydroxyl. Suitable alkali metal silicates include sodium silicate. [0019] The polyorganosilicate resin prepared as described above typically contains silicon bonded hydroxyl groups, i.e., of formulae, HOSi _3/2 and/or (HO) _x R ^M _(3-x) SiO _1/2 , where subscript x is 1, 2, or 3. The concentration of silicon bonded hydroxyl groups present in the polyorganosilicate resin may be determined using Fourier Transform-Infra Red (FTIR) spectroscopy according to ASTM Standard E-168-16. For certain applications, it may be desirable for the amount of silicon bonded hydroxyl groups to be below 0.7%, alternatively below 0.3%, alternatively less than 1%, and alternatively 0.3% to 0.8%. Silicon bonded hydroxyl groups formed during preparation of the polyorganosilicate resin can be converted to trihydrocarbyl siloxane groups or to a different hydrolyzable group by reacting the silicone resin with a silane, disiloxane, or disilazane containing the appropriate terminal group. Silanes containing hydrolyzable groups may be added in molar excess of the quantity required to react with the silicon bonded hydroxyl groups on the polyorganosilicate resin. [0020] Alternatively, the polyorganosilicate resin may have terminal aliphatically unsaturated Page 6 of 26

groups (e.g., alkenyl groups). The polyorganosilicate resin having terminal aliphatically unsaturated groups may be prepared by reacting the product of Daudt, et al. with an unsaturated organic group-containing endblocking agent and an endblocking agent free of aliphatic unsaturation, in an amount sufficient to provide from 3 to 30 mole percent of unsaturated organic groups in the final product. Examples of endblocking agents include, but are not limited to, silazanes, siloxanes, and silanes. Suitable endblocking agents are known in the art and exemplified in U.S. Patents 4,584,355; 4,591,66; and 4,585,836. A single endblocking agent or a mixture of such agents may be used to prepare such resin. [0021] The polyorganosilicate resin may have unit formula: (R ¹ ₂ R ² SiO _1/2 ) _d (R ¹ ₃ SiO _2/2 ) _e (SiO _4/2 ) _f (HO _1/2 ) _g , where R ¹ and R ² are as described above, subscripts e, f, g, and h represent mole fractions of each unit in the resin and have values such that d > 0, e ≥ 0, f > 0, a quantity (d + e + f) = 1, and the resin has a number average molecular weight of 1,500 g/mol to 15,000 g/mol, and subscript g > 0, with the proviso that subscript g has a value sufficient to provide the resin with a hydroxyl content of 0 to 2 weight % based on weight of the resin. Polyorganosilicate resins are also commercially available, for example, DOWSIL™ 6-3444 Int is available from DSC. [0022] The amount of (B) the polyorganosilicate resin in the hydrosilylation curable polyorganosiloxane composition depends on various factors including the type and amount of (A) the polydiorganosiloxane polymer, the alkenyl contents of starting materials (A) and (B) and the silicon bonded hydrogen content of starting material (C). However, the amount of (B) the polyorganosilicate resin may be 40 % to 48.59%, based on combined weights of starting materials (A), (B), (C), and (D). (C) Polyorganohydrogensiloxane [0023] Starting material (C) for the hydrosilylation curable polyorganosiloxane composition is polyorganohydrogensiloxane. The polyorganohydrogensiloxane may have unit formula: (R ¹ 2HSiO1/2)h(R ¹ 3SiO1/2)i(R ¹ 2SiO2/2)j(R ¹ HSiO2/2)k, where R ¹ is as described above, subscripts h, i, j, and k represent average numbers of each unit per molecule, 0 ≤ h ≤ 2, 0 ≤ i ≤ 2, (h + i) = 2, 0 ≤ j < 10, 0 < k < 10, 0 < (j + k) < 10, and 2 ≤ (h + k) ≤ 12. Alternatively, h may be 0 and i may be 2. Alternatively, j may be 0 to 5, alternatively 1 to 4, alternatively 2 to 4, and alternatively 3 to 3.5. Alternatively, k may be 1 to 10, alternatively 2 to 9, alternatively 3 to 8, alternatively 4 to 7, and alternatively 5 to 6. Page 7 of 26

[0024] Suitable polyorganohydrogensiloxanes for use herein are exemplified by: (i) bis- dimethylhydrogensiloxy-terminated poly(dimethylsiloxane/methylhydrogensiloxane), (ii) bis- dimethylhydrogensiloxy-terminated polymethylhydrogensiloxane, (iii) bis-trimethylsiloxy- terminated poly(dimethylsiloxane/methylhydrogensiloxane), (iv) bis-trimethylsiloxy-terminated polymethylhydrogensiloxane, (v) α-dimethylhydrogensiloxy- ω-trimethylsiloxy-terminated poly(dimethylsiloxane/methylhydrogensiloxane), (vi) α- dimethylhydrogensiloxy-ω-trimethylsiloxy-terminated polymethylhydrogensiloxane, and (vii) a combination of two or more thereof. [0025] Polyorganohydrogensiloxanes are also commercially available, such as those available from Gelest, Inc. of Morrisville, Pennsylvania, USA, for example, HMS-H271 (i), HMS-071 (iii), HMS-993 (iv); HMS-301 and HMS-301 R (iii), HMS-031 (iii), HMS-991 (iv), HMS-992 (iv), HMS-993 (iv) HMS-082 (iii), HMS-151 (iii), HMS-013 (iii), HMS-053 (iii), HAM-301 (octyl functional), and HMS-HM271 (v). Alternatively, the polyorganohydrogensiloxane for use herein may be selected from the group consisting of (iii) bis-trimethylsiloxy-terminated poly(dimethylsiloxane/methylhydrogensiloxane), (iv) bis-trimethylsiloxy-terminated polymethylhydrogensiloxane, and a combination thereof. Polyorganohydrogensiloxanes are also available from DSC, such as DOWSIL™ 6-3570 Polymer. Methods of preparing polyorganohydrogensiloxanes suitable for use herein, such as hydrolysis and condensation of organohalosilanes, are well known in the art, as exemplified in U.S. Patent 2,87,218 to Speier, et al.; U.S. Patent 3,957,713 to Jeram et al.; U.S. Patent 4,329,273 to Hardman, et al. [0026] The silicon-bonded hydrogen (Si-H) content of polyorganohydrogensiloxanes can be determined using quantitative infra-red analysis in accordance with ASTM E168. The silicon-bonded hydrogen to alkenyl (e.g., vinyl) ratio (i.e., SiH/Vi ratio) is important when relying on a hydrosilylation reaction cure process. Generally, this is determined by calculating the total weight % of alkenyl groups in the composition, e.g. vinyl [V] and the total weight % of silicon bonded hydrogen [H] in the composition and given the molecular weight of hydrogen is 1 and of vinyl is 27 the molar ratio of silicon bonded hydrogen to vinyl is 27[H]/[V]. Starting materials (A), (B), and (C) described above, may be selected so as to provide an SiH/Vi ratio of 0.3 to 0.55, alternatively 0.31 to 0.53, alternatively 0.4 to 0.5, and alternatively 0.41 to 0.49. (D) Hydrosilylation Reaction Catalyst [0027] Starting material (D) in the hydrosilylation curable polyorganosiloxane composition is a Page 8 of 26

hydrosilylation reaction catalyst. This catalyst will promote a reaction between the alkenyl groups in starting materials (A) and (B) and the silicon bonded hydrogen atoms in starting material (C) and. Said catalyst comprises a platinum group metal. The platinum group metal may be selected from the group consisting of platinum, rhodium, ruthenium, palladium, osmium, and iridium. Alternatively, the platinum group metal may be platinum. For example, hydrosilylation reaction catalyst may be selected from the group consisting of (D-1) the platinum group metal, described above; (D-2) a compound of such a metal, for example, chloridotris(triphenylphosphane)rhodium(I) (Wilkinson’s Catalyst), a rhodium diphosphine chelate such as [1,2-bis(diphenylphosphino)ethane]dichlorodirhodium or [1,2- bis(diethylphospino)ethane]dichlorodirhodium, chloroplatinic acid (Speier’s Catalyst), chloroplatinic acid hexahydrate, platinum dichloride; (D-3) a complex of a compound, (D-2), with an alkenyl-functional organopolysiloxane; (D-4) a platinum group metal compound microencapsulated in a matrix or coreshell type structure; or (D-5) a complex (D-3) microencapsulated in such matrix or coreshell type structure. Complexes of platinum with alkenyl-functional organopolysiloxanes include 1,3-diethenyl-1,1,3,3-tetramethyldisiloxane complexes with platinum (Karstedt’s Catalyst) and Pt(0) complex in tetramethyltetravinylcyclotetrasiloxane (Ashby’s Catalyst). Specific examples of suitable platinum-containing catalysts for starting material (D) include chloroplatinic acid, either in hexahydrate form or anhydrous form, or a platinum-containing catalyst which is obtained by a method comprising reacting chloroplatinic acid with an aliphatically unsaturated organosilicon compound such as divinyltetramethyldisiloxane, or alkene-platinum-silyl complexes as described in U.S. Patent 6,605,734 to Roy. These alkene-platinum-silyl complexes may be prepared, for example by mixing 0.015 mole (COD)PtCl2 with 0.045 mole COD and 0.0612 moles HMeSiCl2, where COD represents cyclooctadienyl and Me represents methyl. Other exemplary hydrosilylation reaction catalysts are described in U.S. Patents 2,87,218 to Speier; 3,159,601 to Ashby; 3,60,972 to Lamoreaux; 3,296,291 to Chalk, et al.; 3,419,593 to Willing; 3,516,946 to Modic; 3,715,334 to Karstedt; 3,814,730 to Karstedt; 3,928,629 to Chandra; 3,989,668 to Lee, et al.; 4,766,176 to Lee, et al.; 4,784,879 to Lee, et al.; 5,017,654 to Togashi; 5,036,117 to Chung, et al.; and 5,175,325 to Brown; and EP 0 347 895 A to Togashi, et al. Suitable hydrosilylation reaction catalysts for starting material (D) are commercially available, for example, DOWSIL™ 3-8015 Int (Platinum #2), SYL-OFF™ 4000 Catalyst, and SYL-OFF™ 2700 are available from Page 9 of 26

DSC. [0028] Starting material (D) may be one hydrosilylation reaction catalyst or a combination of two or more of the hydrosilylation reaction catalysts described above. The amount of (D) the hydrosilylation reaction catalyst in the composition will depend on various factors including the selection of starting materials (A), (B), and (C), and when present any optional additional starting materials; and their respective contents of alkenyl groups and silicon bonded hydrogen atoms, and whether a hydrosilylation reaction inhibitor present in the composition, however, the amount of catalyst is sufficient to catalyze hydrosilylation reaction of SiH and alkenyl groups, alternatively the amount of catalyst is sufficient to provide at least 0.01 ppm, alternatively at least 0.05 ppm, alternatively at least 0.1 ppm, alternatively at least 0.5 ppm, and alternatively at least 1 ppm, by mass of the platinum group metal based on combined amounts of starting materials (A), (B), (C), and (D). At the same time, the amount of catalyst is sufficient to provide up to 800 ppm, alternatively up to 500 ppm, and alternatively up to 100 ppm by mass of the platinum group metal, on the same basis. Alternatively, when (D) the hydrosilylation reaction catalyst comprises platinum complexed with an alkenyl-functional organosiloxane, the amount may be 0.01 weight % to 0.02 weight %, based on combined weights of starting materials (A) to (D). Additional Starting Materials [0029] The hydrosilylation curable polyorganosiloxane composition may optionally further comprise one or more additional starting materials. For example, the additional starting material may be selected from the group consisting of (E) a hydrosilylation reaction inhibitor, (F) an adhesion promoter, (G) a solvent, and (H) a wetting agent, and a combination of two or more of (E) to (H). (E) Hydrosilylation Reaction Inhibitor [0030] Starting material (E) is a hydrosilylation reaction inhibitor (inhibitor) that may be used for altering the rate of the hydrosilylation reaction, as compared to a composition containing the same starting materials but with the inhibitor omitted. Starting material (E) may be selected from the group consisting of (E1) an acetylenic alcohol, (E2) a silylated acetylenic alcohol, (E3) an ene- yne compound, (E4) a triazole, (E5) a phosphine, (E6) a mercaptan, (E7) a hydrazine, (E8) an amine, (E9) a fumarate, (E10) a maleate, (E11) an ether, (E12) carbon monoxide, (E13) an alkenyl- functional siloxane oligomer, and (E14) a combination of two or more thereof. Alternatively, the hydrosilylation reaction inhibitor may be selected from the group consisting of (E1) an acetylenic Page 10 of 26

alcohol, (E2) a silylated acetylenic alcohol, (E9) a fumarate, (E10) a maleate, (E13) carbon monoxide, (E14) a combination of two or more thereof. [0031] Acetylenic alcohols are exemplified by 3,5-dimethyl-1-hexyn-3-ol, 1-butyn-3-ol, 1- propyn-3-ol, methyl butynyls such as 2-methyl-3-butyn-2-ol and 3-methyl-1-butyn-3-ol, 3- methyl-1-pentyn-3-ol, 3-phenyl-1-butyn-3-ol, 4-ethyl-1-octyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, and ethynyl cyclohexanols such as 1-ethynyl-1-cyclohexanol, and a combination thereof. Acetylenic alcohols are known in the art and are commercially available from various sources, see for example, U.S. Patent 3,445,420 to Kookootsedes et al. Alternatively, the inhibitor may be a silylated acetylenic compound. Without wishing to be bound by theory, it is thought that adding a silylated acetylenic compound reduces yellowing of the reaction product prepared from hydrosilylation reaction as compared to a reaction product from hydrosilylation of starting materials that do not include a silylated acetylenic compound or that include an organic acetylenic alcohol inhibitor, such as those described above. The silylated acetylenic compound is exemplified by (3-methyl-1-butyn-3-oxy)trimethylsilane, ((1,1-dimethyl-2-propynyl)oxy)trimethylsilane, bis(3-methyl-1-butyn-3-oxy)dimethylsilane, bis(3-methyl-1-butyn-3- oxy)silanemethylvinylsilane, bis((1,1-dimethyl-2-propynyl)oxy)dimethylsilane, methyl(tris(1,1- dimethyl-2-propynyloxy))silane, methyl(tris(3-methyl-1-butyn-3-oxy))silane, (3-methyl-1-butyn- 3-oxy)dimethylphenylsilane, (3-methyl-1-butyn-3-oxy)dimethylhexenylsilane, (3-methyl-1- butyn-3-oxy)triethylsilane, bis(3-methyl-1-butyn-3-oxy)methyltrifluoropropylsilane, (3,5- dimethyl-1-hexyn-3-oxy)trimethylsilane, (3-phenyl-1-butyn-3-oxy)diphenylmethylsilane, (3- phenyl-1-butyn-3-oxy)dimethylphenylsilane, (3-phenyl-1-butyn-3-oxy)dimethylvinylsilane, (3- phenyl-1-butyn-3-oxy)dimethylhexenylsilane, (cyclohexyl-1-ethyn-1- oxy)dimethylhexenylsilane, (cyclohexyl-1-ethyn-1-oxy)dimethylvinylsilane, (cyclohexyl-1- ethyn-1-oxy)diphenylmethylsilane, (cyclohexyl-1-ethyn-1-oxy)trimethylsilane, and combinations thereof. The silylated acetylenic compound useful as the inhibitor herein may be prepared by methods known in the art, for example, U.S. Patent 6,677,407 to Bilgrien, et al. discloses silylating an acetylenic alcohol described above by reacting it with a chlorosilane in the presence of an acid receptor. [0032] Alternatively, the inhibitor may be an ene-yne compound such as 3-methyl-3-penten-1- yne, 3,5-dimethyl-3-hexen-1-yne; and a combination thereof. Alternatively, the inhibitor may comprise a triazole, exemplified by benzotriazole. Alternatively, the inhibitor may comprise a Page 11 of 26

phosphine. Alternatively, the inhibitor may comprise a mercaptan. Alternatively, the inhibitor may comprise a hydrazine. Alternatively, the inhibitor may comprise an amine. Amines are exemplified by tetramethyl ethylenediamine, 3-dimethylamino-1-propyne, n- methylpropargylamine, propargylamine, 1-ethynylcyclohexylamine, or a combination thereof. Alternatively, the inhibitor may comprise a fumarate. Fumarates include dialkyl fumarates such as diethyl fumarate, dialkenyl fumarates such as diallyl fumarate, and dialkoxyalkyl fumarates such as bis-(methoxymethyl)ethyl fumarate. Alternatively, the inhibitor may comprise a maleate. Maleates include dialkyl maleates such as diethyl maleate, dialkenyl maleates such as diallyl maleate, and dialkoxyalkyl maleates such as bis-(methoxymethyl)ethyl maleate. Alternatively, the inhibitor may comprise an ether. [0033] Alternatively, the inhibitor may comprise carbon monoxide. Alternatively, the inhibitor may comprise an alkenyl-functional siloxane oligomer, which may be cyclic or linear such as methylvinylcyclosiloxanes exemplified by 1,3,5,7-tetramethyl-1,3,5,7- tetravinylcyclotetrasiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetrahexenylcyclotetrasiloxane, 1,3- divinyl-1,3-diphenyl-1,3-dimethyldisiloxane; 1,3-divinyl-1,1,3,3-tetramethyldisiloxane; and a combination of two or more thereof. The compounds useful as inhibitors described above are commercially available, e.g., from Sigma-Aldrich Inc. or Gelest, Inc., and are known in the art, for example, see U.S. Patent 3,989,667 to Lee, et al. Suitable inhibitors for use herein are exemplified by those described as stabilizer E in U.S. Patent Application Publication 20007/0099007 at paragraphs [0148] to [0165]. [0034] The amount of inhibitor will depend on various factors including the desired pot life, whether the composition will be a one part composition or a multiple part composition, the particular inhibitor used, and the selection and amount of the hydrosilylation reaction catalyst. However, the amount of inhibitor may be 0 % to 1 %, alternatively 0 % to 5 %, alternatively 0.001 % to 1 %, alternatively 0.01 % to 0.5 %, and alternatively 0.0025 % to 0.025 %, based on the combined weights of starting materials (A), (B), (C), and (D) in the composition. (F) Adhesion Promoter [0035] Starting material (F) is an adhesion promoter that may optionally be added to the hydrosilylation curable polyorganosiloxane composition. Suitable adhesion promoters may comprise a transition metal chelate, a hydrocarbonoxysilane such as an alkoxysilane, a combination of an alkoxysilane and a hydroxy-functional polyorganosiloxane, an aminofunctional Page 12 of 26

silane, or a combination thereof. Adhesion promoters are known in the art and may comprise silanes having the formula R ³ rR ⁴ sSi(OR ⁵ )4-(r + s) where each R ³ is independently a monovalent organic group having at least 3 carbon atoms; R ⁴ contains at least one SiC bonded substituent having an adhesion-promoting group, such as amino, epoxy, mercapto or acrylate groups; subscript r has a value ranging from 0 to 2; subscript s is either 1 or 2; and the sum of (r + s) is not greater than 3. Each R ⁵ is independently a saturated hydrocarbon group. Saturated hydrocarbon groups for R ⁵ may be, for example, an alkyl group of 1 to 4 carbon atoms, alternatively 1 to 2 carbon atoms. R ⁵ is exemplified by methyl, ethyl, propyl, and butyl. Alternatively, the adhesion promoter may comprise a partial condensate of the above silane. Alternatively, the adhesion promoter may comprise a partial condensate of the above silane. Alternatively, the adhesion promoter may comprise a combination of an alkoxysilane and a hydroxy-functional polyorganosiloxane. [0036] Alternatively, the adhesion promoter may comprise an unsaturated or epoxy-functional compound. The adhesion promoter may comprise an unsaturated or epoxy-functional alkoxysilane. For example, the functional alkoxysilane can have the formula R ^{6 7} tSi(OR ) _(4-t) , where subscript t is 1, 2, or 3, alternatively subscript t is 1. Each R ⁶ is independently a monovalent organic group with the proviso that at least one R ⁶ is an unsaturated organic group or an epoxy- functional organic group. Epoxy-functional organic groups for R ⁶ are exemplified by 3- glycidoxypropyl and (epoxycyclohexyl)ethyl. Unsaturated organic groups for R ⁶ are exemplified by 3-methacryloyloxypropyl, 3-acryloyloxypropyl, and unsaturated monovalent hydrocarbon groups such as vinyl, allyl, hexenyl, undecylenyl. Each R ⁷ is independently a saturated hydrocarbon group of 1 to 4 carbon atoms, alternatively 1 to 2 carbon atoms. R ⁷ is exemplified by Me, ethyl, propyl and butyl. [0037] Examples of suitable epoxy-functional alkoxysilanes include 3- glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, (epoxycyclohexyl)ethyldimethoxysilane, (epoxycyclohexyl)ethyldiethoxysilane and combinations thereof. Examples of suitable unsaturated alkoxysilanes include vinyltrimethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, hexenyltrimethoxysilane, undecylenyltrimethoxysilane, 3-methacryloyloxypropyl trimethoxysilane, 3- methacryloyloxypropyl triethoxysilane, 3-acryloyloxypropyl trimethoxysilane, 3- acryloyloxypropyl triethoxysilane, and combinations thereof. Page 13 of 26

[0038] Alternatively, the adhesion promoter may comprise an epoxy-functional siloxane such as a reaction product of a hydroxy-terminated polyorganosiloxane with an epoxy-functional alkoxysilane, as described above, or a physical blend of the hydroxy-terminated polyorganosiloxane with the epoxy-functional alkoxysilane. The adhesion promoter may comprise a combination of an epoxy-functional alkoxysilane and an epoxy-functional siloxane. For example, the adhesion promoter is exemplified by a mixture of 3- glycidoxypropyltrimethoxysilane and a reaction product of hydroxy-terminated methylvinylsiloxane with 3-glycidoxypropyltrimethoxysilane, or a mixture of 3- glycidoxypropyltrimethoxysilane and a hydroxy-terminated methylvinylsiloxane, or a mixture of 3-glycidoxypropyltrimethoxysilane and a hydroxy-terminated methylvinyl/dimethylsiloxane copolymer. [0039] Alternatively, the adhesion promoter may comprise an aminofunctional silane, such as an aminofunctional alkoxysilane exemplified by H ₂ N(CH ₂ ) ₂ Si(OCH ₃ ) ₃ , H ₂ N(CH ₂ ) ₂ Si(OCH ₂ CH ₃ ) ₃ , H ₂ N(CH ₂ ) ₃ Si(OCH ₃ ) ₃ , H ₂ N(CH ₂ ) ₃ Si(OCH ₂ CH ₃ ) ₃ , CH ₃ NH(CH ₂ ) ₃ Si(OCH ₃ ) ₃ , CH ₃ NH(CH ₂ ) ₃ Si(OCH ₂ CH ₃ ) ₃ , CH ₃ NH(CH ₂ ) ₅ Si(OCH ₃ ) ₃ , CH ₃ NH(CH ₂ ) ₅ Si(OCH ₂ CH ₃ ) ₃ , H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₃ Si(OCH ₃ ) ₃ , H ₂ N(CH ₂ ) ₂ NH(CH ₂ ) ₃ Si(OCH ₂ CH ₃ ) ₃ , CH ₃ NH(CH ₂ ) ₂ NH(CH ₂ ) ₃ Si(OCH ₃ ) ₃ , CH ₃ NH(CH ₂ ) ₂ NH(CH ₂ ) ₃ Si(OCH ² CH ³ ) ³ , C4H9NH(CH2)2NH(CH2)3Si(OCH3)3, C4H9NH(CH2)2NH(CH2)3Si(OCH2CH3)3, H2N(CH2)2SiCH3(OCH3)2, H ₂ N(CH ₂ ) ₂ SiCH ₃ (OCH ₂ CH ₃ ) ₂ , H ₂ N(CH ₂ ) ₃ SiCH ₃ (OCH ₃ ) ₂ , H ₂ N(CH ₂ ) ₃ SiCH ₃ (OCH ₂ CH ₃ ) ₂ , CH ₃ NH(CH ₂ ) ₃ SiCH ₃ (OCH ₃ ) ₂ , CH ₃ NH(CH ₂ ) ₃ SiCH ₃ (OCH ₂ CH ₃ ) ₂ , CH ₃ NH(CH ₂ ) ₅ SiCH ₃ (OCH ₃ ) ₂ , CH3NH(CH2)5SiCH3(OCH2CH3)2, H2N(CH2)2NH(CH2)3SiCH3(OCH3)2, H2N(CH2)2NH(CH2)3SiCH3(OCH2CH3)2, CH3NH(CH2)2NH(CH2)3SiCH3(OCH3)2, CH ₃ NH(CH ₂ ) ₂ NH(CH ₂ ) ₃ SiCH ₃ (OCH ₂ CH ₃ ) ₂ , C ₄ H ₉ NH(CH ₂ ) ₂ NH(CH ₂ ) ₃ SiCH ₃ (OCH ₃ ) ₂ , C4H9NH(CH2)2NH(CH2)3SiCH3(OCH2CH3)2, and a combination thereof. [0040] Alternatively, the adhesion promoter may comprise a transition metal chelate. Suitable transition metal chelates include titanates, zirconates such as zirconium acetylacetonate, aluminum chelates such as aluminum acetylacetonate, and combinations thereof. Alternatively, the adhesion promoter may comprise a combination of a transition metal chelate with an alkoxysilane, such as Page 14 of 26

a combination of glycidoxypropyltrimethoxysilane with an aluminum chelate or a zirconium chelate. [0041] The amount of adhesion promoter depends on various factors including the species of adhesion promoter selected and the end use of the composition and cured product thereof. However, the amount of adhesion promoter may be > 0 to < 2% based on combined amounts of starting materials (A), (B), (C), and (D). (G) Solvent [0042] Starting material (G) is a solvent that may optionally be added to facilitate combination of one or more starting materials. For example, (B) the alkenyl functional polyorganosilicate resin and/or (D) the hydrosilylation reaction catalyst may be delivered in a solvent. The solvent may comprise a hydrocarbon, a halogenated hydrocarbon, or a cyclic siloxane having an average degree of polymerization from 3 to 10, and/or a halogenated hydrocarbon. Suitable hydrocarbons can be i) an aromatic hydrocarbon such as benzene, toluene, ethyl benzene or xylene; ii) an aliphatic hydrocarbon such as hexane, heptane, octane, or iso-paraffin; or a combination thereof. Suitable halogenated hydrocarbons include trichloroethylene; per-chloroethylene; trifluoromethylbenzene; 1,3-bis(trifluoromethyl)benzene; methylpentafluorobenzene; dichloromethane; 1,1,1- trichloroethane; and methylene chloride. Suitable cyclic siloxanes having a degree of polymerization from 3 to 10, alternatively 3 to 6, include hexamethylcyclotrisiloxane, octamethylcyclotetrasiloxane, and/or decamethylcyclopentasiloxane. The exact amount of solvent can vary depending on the types and amounts of the starting materials to be combined and the species of solvent selected, however, the amount of solvent may be selected such that the composition forms is homogenous mixture. The amount of solvent may be > 0 % to < 100%, alternatively 10 % to 90 %, alternatively 5% to 80 %, based on combined weights of starting materials (A), (B), (C), and (D). All or a portion of the solvent may optionally be removed after the composition is prepared. (H) Wetting Agent [0043] The hydrosilylation curable polyorganosiloxane composition may optionally further comprise a wetting agent, which is a surface-active molecule that can reduce the surface tension of the composition and may facilitate uniform distribution of the composition in a mold or on a substrate, thereby helping to fill gaps and/or form a uniform silicone encapsulation film after curing. The wetting agent may be a nonfunctional polydiorganosiloxane, such as a bis- Page 15 of 26

trimethylsiloxy-terminated polydimethylsiloxane with viscosity of 5 to 100 cP. Such wetting agents are known in the art and commercially available, for example, under the tradename DOWSIL™ 200 Fluids from DSC. The amount of wetting agent may be 0 to 1%, based on combined weights of starting materials (A), (B), (C), and (D). [0044] The hydrosilylation curable polyorganosiloxane composition may be free of filler or contain only a limited amount of filler, such as 0 to 30% by weight based on combined weights of all starting materials in the composition. Without wishing to be bound by theory, it is thought that fillers can agglomerate or otherwise stick to the equipment used to apply or dispense the composition, and fillers can hinder optical properties, for example transparency, of the composition and of the silicone encapsulation film formed therewith, if optical transparency is desired. The fillers may also be prejudicial to the adherence of the silicone encapsulation film to substrates. Method for Making the Composition [0045] The composition described above may be prepared by any convenient means such as mixing the starting materials at RT using conventional equipment, such as an agitated vessel or static mixer. The inhibitor, when used, may be added before the hydrosilylation reaction catalyst, for example, when the composition will be prepared at elevated temperature and/or composition will be prepared as a one part composition. One or more of the starting materials, e.g., (B) the polyorganosilicate resin and (D) the hydrosilylation reaction catalyst may be delivered in a solvent when combined with one or more of the other starting materials in the composition. All or a portion of the solvent may be removed after mixing the starting materials, under conditions that do not cure the composition (e.g., by reducing pressure or heating at a temperature sufficient to volatilize the solvent but insufficient to cure the composition). One skilled in the art would understand that the resulting composition contains no solvent or may contain trace amounts of residual solvent from delivery of a starting material, however, a solvent (e.g., organic solvent such as toluene or non-functional polydiorganosiloxane) is not intentionally added to the composition. [0046] Alternatively, the composition may be prepared as a multiple part composition, for example, when the composition will be stored for a long period of time before use, e.g., up to 6 hours before dispensing on a substrate or into a mold. In the multiple part composition, the hydrosilylation reaction catalyst is stored in a separate part from any starting material having a Page 16 of 26

silicon bonded hydrogen atom, e.g., the polyorganohydrogensiloxane, and the parts are combined shortly before use of the composition (e.g., by mixing at RT). [0047] For example, a multiple part composition may be prepared by combining starting materials comprising at least some of (A) the alkenyl-functional polydiorganosiloxane polymer, (C) the polyorganohydrogensiloxane, and optionally one or more other additional starting materials described above to form a base part, by any convenient means such as mixing. A curing agent may be prepared by combining starting materials comprising at least some of (A) the alkenyl- functional polydiorganosiloxane polymer, (D) the hydrosilylation reaction catalyst, and optionally one or more other additional starting materials described above by any convenient means such as mixing. The starting materials may be combined at RT or elevated temperature. The hydrosilylation reaction inhibitor may be included in one or more of the base part, the curing agent part, or a separate additional part. The adhesion promoter may be added to the base part, or may be added as a separate additional part. Starting material (B), the alkenyl-functional polyorganosilicate resin, may be added to the base part or a separate additional part. When a two part composition is used, the weight ratio of amounts of base part to curing agent part may range from 1:1 to 10:1. The composition will cure via hydrosilylation reaction to form a silicone encapsulation film. [0048] When a solvent is present, the method may optionally further comprise removing the all, or a portion, of the solvent before and/or during curing. Removing solvent may be performed by any convenient means, such as heating at a temperature that vaporizes the solvent without fully curing the composition, e.g., heating at a temperature of 70°C to 120°C, alternatively 50°C to 100°C, and alternatively 70°C to 80°C for a time sufficient to remove all or a portion of the solvent (e.g., 30 seconds to 1 hour, alternatively 1 minute to 5 minutes). [0049] Curing the composition may be performed by heating at a temperature of 80°C to 200°C, alternatively 90°C to 180°C, alternatively 100°C to 160°C, and alternatively 110°C to 150°C for a time sufficient to cure the pressure sensitive adhesive composition (e.g., for 30 seconds to an hour, alternatively 1 to 5 minutes). If cure speed needs to be increased or the process temperatures lowered, the catalyst level can be increased and/or the inhibitor amount may be decreased. This forms a cured silicone. Curing may be performed by placing the composition (e.g., in a mold or coated as a film on a substrate) in an oven. The amount of the composition used depends on the specific application, however, the amount may be sufficient such that after curing thickness of the Page 17 of 26

resulting cured silicone may be 5 micrometers to 50 micrometers, and for protective film the thickness may be 6 micrometers to 50 micrometers, alternatively 8 micrometers to 40 micrometers, and alternatively 10 to 30 micrometers. Method for Making the Silicone Encapsulation film [0050] The composition prepared as described above is useful in a method for forming a silicone encapsulation film. This method comprises: (1) forming into a film, the hydrosilylation curable polyorganosiloxane composition, where the composition comprises (A) the polydiorganosiloxane polymer; (B) the alkenyl functional polyorganosilicate resin; (C) the polyorganohydrogensiloxane; and (D) the hydrosilylation reaction catalyst, where starting materials (A), (B), (C), and (D) and the method of preparing the composition are as described above; and (2) curing the hydrosilylation curable polyorganosiloxane composition, thereby forming the silicone encapsulation film. Step (1) may be performed by any convenient means, such as molding, e.g., dispensing the hydrosilylation curable polyorganosiloxane composition into a mold such as a steel frame, or printing (e.g., ink jet printing) the hydrosilylation curable polyorganosiloxane composition on a substrate. The hydrosilylation reaction curable composition may be used in an amount sufficient to provide the silicone encapsulation film with a thickness up to 50 micrometers, alternatively 1 to 50 micrometers after curing in step (2). Step (2) may be performed by heating at a temperature of 80 °C to 150 °C for 15 minutes to 1 hour, e.g., by placing in an oven. Optionally, increased pressure may be applied in step (2). Method of Use for the Silicone Encapsulation Film [0051] The silicone encapsulation film prepared as described above is suitable for use in an OLED display, for example to cover a humidity-sensitive electronic component in the OLED display. For example, a method comprises covering a humidity-sensitive electronic component in an OLED display with the hydrosilylation reaction curable composition described above, and curing said composition to prepare the silicone encapsulation film, as described above. [0052] Figure 1 shows a structure scheme for a component of a transparent and rigid OLED with a glass substrate (100). The component (100) includes a dam (101), which houses a color filter (102), a passivation layer (105), and a thin film transistor and white organic light emitting diode (104). The silicone encapsulation film prepared as described above (103) surrounds the color filter (102), passivation layer (105), and thin film transistor and white organic light emitting diode (104), Page 18 of 26

thereby protecting them from moisture and other damage. The component (100) is mounted to a glass substrate (106). EXAMPLES [0053] These examples are intended to illustrate the invention to one skilled in the art and are not to be construed as limiting the scope of the invention set forth in the appended claims. Starting materials used in these examples are described below in Table 1. Table 1 – Starting Materials [0054] Hydrosilylation curable polyorganosiloxane compositions (samples) were prepared as follows. The starting materials as described in Table 1 in the amounts (weight parts) shown below in Table 2 were weighed into a vessel and mixed using a Thinky mixer at 1500 rpm for 2 min. Table 2. Hydrosilylation Curable Polyorganosiloxane Compositions with Amounts in Weight % Page 19 of 26

[0055] In Table 2, Ex. 1, Ex. 2, Ex.3, and Ex. 8 were comparative. Ex. 1, Ex. 2, and Ex.3 each had a polyorganohydrogensiloxane content > 2.5% and SiH/Vi ratio > 0.55. Ex. 8 had a polyorganohydrogensiloxane content < 1.4% and SiH/Vi ratio < 0.30. [0056] To prepare silicone encapsulation films, 15 mL of each sample described in Table 2 was poured into a steel frame and pressed using a hydraulic hot press at 100 ⁰C for 30 min. The resulting films had thicknesses of 1.8 to 2 mm. [0057] Modulus of each film was measured using a Modulus Compact Rheometer (MCR, Anton Paar) at RT. Dielectric constant measurement was measured by placing each film between two 38 mm diameter stainless steel electrodes of an impedance instrument (16451B dielectric text fixture, Keysight). Frequency of 100 kHz and voltage of 1 V were applied at RT. [0058] Hardness was measured using a Hildebrand Durometer (Shore 00), Asker CLE-150LJ (Shore A). Test samples were prepared as 8 mm films and assembled with the instrument. The weight was pressed and hardness value was measured. Results are shown below in Table 3. Table 3. Results [0059] The data in Table 3 showed that effect of cyclic siloxane content (e.g., DOWSIL™ 1- 687) on properties of the cured film was negligible. Ex. 1, Ex. 2, and Ex. 3 showed that dielectric constant and modulus were too high when SiH/Vi ratio and polyorganohydrogensiloxane content of the composition were higher than as described below in claim 1. Ex. 8, which contained less polyorganohydrogensiloxane (crosslinker) than described below in claim 1 cured to form a gel state, not a rigid film, such that Dk could not be measured. Examples 4 to 7 showed that a silicone Page 20 of 26

encapsulation film with hardness, dielectric constant, and storage modulus suitable for use in OLED displays could be prepared under the conditions tested. The hydrosilylation curable polyorganosiloxane composition can be cured to form the silicone encapsulation film with 0.5 ≤ G ≤ 1 at RT; Dk < 2.8, and Shore A hardness of at least 12, alternatively 12 to 45. Industrial Applicability [0060] The silicone encapsulation film is prepared by curing the hydrosilylation curable polyorganosiloxane composition, as described herein. The hydrosilylation reaction curable composition can provide the silicone encapsulation film with a storage modulus, G, with a value such that 0.05 MPa < G < 1 MPa at RT. Without wishing to be bound by theory, it is thought that modulus in the range above will provide a Dk < 2.8 to the silicone encapsulation film. Furthermore, without wishing to be bound by theory, it is thought that if the modulus is lower than 0.05 MPa, the silicone encapsulation film may have insufficient rigidity or have a gel state, and tackiness may increase to an undesirable level, however, if the modulus is more than 1 MPA, then Dk may be > 2.8. Definitions and Usage of Terms [0061] All amounts, concentrations, ratios, and percentages are by weight unless otherwise indicated. The SUMMARY and ABSTRACT are hereby incorporated by reference. The articles ‘a’, ‘an’, and ‘the’ each refer to one or more, unless otherwise indicated. The singular includes the plural unless otherwise indicated. Abbreviations are as defined below in Table 4. Table 4. Abbreviations Page 21 of 26

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