Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HYGROSCOPIC FILM AND HYGROSCOPIC LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/145919
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a hygroscopic film and a hygroscopic laminate which absorb a large amount of moisture quickly in order to suppress deterioration of contents caused by moisture absorption. [Solution] A hygroscopic film comprising, in a laminated manner, at least a resin layer that contains a specific polyethylene resin and a moisture absorption layer that contains a specific polyethylene resin and a moisture absorbing agent, or a hygroscopic laminate comprising a moisture-absorbing sealant layer that contains a gas barrier base layer and a moisture absorbing agent, wherein a second resin layer comprising a specific polyethylene resin and a antistatic agent is laminated in the following order: resin layer, moisture absorption layer, and second resin layer.

Inventors:
TADOKORO TATSURO (JP)
NAKADA KIYOSHI (JP)
TAKEUCHI NAOYA (JP)
YONEMOTO TOMOHIRO (JP)
SUZUKI YOSHIHIKO (JP)
Application Number:
PCT/JP2023/002775
Publication Date:
August 03, 2023
Filing Date:
January 30, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
B32B27/32; B32B27/18; B65D65/40
Domestic Patent References:
WO2016024529A12016-02-18
WO2018016562A12018-01-25
WO2020213517A12020-10-22
WO2015046485A12015-04-02
Foreign References:
JP2021037673A2021-03-11
JP2006346998A2006-12-28
JPH08134295A1996-05-28
JP2009040439A2009-02-26
JP2014221514A2014-11-27
Attorney, Agent or Firm:
YUITA Junji et al. (JP)
Download PDF: