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Title:
IC CHIP AND ELECTRONIC DEVICE PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2019/160051
Kind Code:
A1
Abstract:
This electronic device (1) is provided with: an IC chip (100) that has a first region (151) and a second region (152) which are different from each other, wherein at least a part of a control circuit is formed in the first region (151) and a temperature sensing circuit is formed in the second region (152); and a substrate (101) on which the IC chip (100) is mounted. The IC chip (100) is bonded to the substrate (101) by a first bonding member (102) bonded to a portion which is overlapped by the first region (151) of the IC chip (100).

Inventors:
YAJIMA ARITSUGU (JP)
MAKINO KENYO (JP)
Application Number:
PCT/JP2019/005397
Publication Date:
August 22, 2019
Filing Date:
February 14, 2019
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03B5/32; H01L21/60; H01L23/58; H01L25/00; H03H9/19
Foreign References:
JP2013143607A2013-07-22
JP2012191484A2012-10-04
JP2007035847A2007-02-08
JP2015170827A2015-09-28
JP2009027307A2009-02-05
JP2013042425A2013-02-28
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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