Title:
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/188538
Kind Code:
A1
Abstract:
An aspect of the present invention resides in an IC chip mounting device comprising: a transport section for transporting an antenna continuum in which a plurality of inlay antennas is continuously formed on a base material; an IC chip placement section for placing an IC chip on an adhesive provided at a predetermined reference position of each antenna of the antenna continuum; and a unit installation section for replaceably installing a light curing unit that cures the adhesive by irradiation with light while pressing the IC chip placed on the adhesive towards the antenna and a thermal curing unit that cures the adhesive by heating while pressing the IC chip placed on the adhesive towards the antenna.
Inventors:
MAEDA YOSHIMITSU (JP)
Application Number:
PCT/JP2022/043864
Publication Date:
October 05, 2023
Filing Date:
November 29, 2022
Export Citation:
Assignee:
SATO HOLDINGS KK (JP)
International Classes:
H01L21/60; G06K19/077
Domestic Patent References:
| WO2021132622A1 | 2021-07-01 | |||
| WO2003041478A1 | 2003-05-15 |
Foreign References:
| JP2018186147A | 2018-11-22 |
Attorney, Agent or Firm:
GLOBAL IP TOKYO (JP)
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