Title:
IC MODULE AND IC CARD
Document Type and Number:
WIPO Patent Application WO/2012/141246
Kind Code:
A1
Abstract:
This IC module is provided with a substrate which has a first surface and a second surface upon the opposite side of the first surface, and upon which a connection terminal for connecting to a read and write device is formed upon the first surface thereof; an IC chip which is mounted upon the second surface and which is electrically connected to the connection terminal by wire bonding; and a resin mold which covers the IC chip. In the thickness direction of the substrate, the remaining thickness after subtracting the thickness of the IC chip from the thickness of the resin mold is greater than the thickness of the IC chip.
Inventors:
HOSAKA KAZUHIRO (JP)
TSUJII MASATO (JP)
KATOU YUTAKA (JP)
YANAKA MASAAKI (JP)
TSUJII MASATO (JP)
KATOU YUTAKA (JP)
YANAKA MASAAKI (JP)
Application Number:
PCT/JP2012/060013
Publication Date:
October 18, 2012
Filing Date:
April 12, 2012
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD (JP)
HOSAKA KAZUHIRO (JP)
TSUJII MASATO (JP)
KATOU YUTAKA (JP)
YANAKA MASAAKI (JP)
HOSAKA KAZUHIRO (JP)
TSUJII MASATO (JP)
KATOU YUTAKA (JP)
YANAKA MASAAKI (JP)
International Classes:
G06K19/077; B42D15/10
Foreign References:
| JPH0752589A | 1995-02-28 | |||
| JPS62134295A | 1987-06-17 |
Attorney, Agent or Firm:
SUZUKI Shirou et al. (JP)
Shiro Suzuki (JP)
Shiro Suzuki (JP)
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Claims:
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