IC MODULE, METHOD OF FABRICATING THE SAME AND IC CARD PROVIDED WITH IC MODULE

Title:

IC MODULE, METHOD OF FABRICATING THE SAME AND IC CARD PROVIDED WITH IC MODULE

Document Type and Number:

WIPO Patent Application WO/1999/004365

Kind Code:

A1

Abstract:

A method for fabricating an IC module (1) including a resin packaging step conducted by using top and bottom forces (5) defining a cavity (50) in a clamped state, wherein the packaging step comprises placing a substrate (2) on which an IC chip (3) is mounted and a winding coil (20A) having a doughnut-like planar shape and a flat overall shape in a cavity (50) and injecting a molten resin into the cavity (50). When resin packaging is conducted on a substrate (2) on which an antenna coil (20) is patterned, spacers (28) having a height equal to or substantially equal to that of the cavity (50) are provided on the substrate (2), which is then placed in the cavity (50) and packaged by injecting the molten resin. Alternatively, the substrate (2) in the cavity (50) may be vacuum-clamped. The IC chip (3) and the antenna coil (20) can be well protected by such a method.

Inventors:

HIRAI MINORU (JP)
UEDA SHIGEYUKI (JP)
MIYATA OSAMU (JP)
HORIO TOMOHARU (JP)

Application Number:

PCT/JP1998/003141

Publication Date:

January 28, 1999

Filing Date:

July 13, 1998

Export Citation:

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Assignee:

ROHM CO LTD (JP)
HIRAI MINORU (JP)
UEDA SHIGEYUKI (JP)
MIYATA OSAMU (JP)
HORIO TOMOHARU (JP)

International Classes:

B29C45/14; B42D15/10; G06K19/07; G06K19/077; H01Q7/00; B29C45/00; (IPC1-7): G06K19/00

Foreign References:

JPH0789274A	1995-04-04
JPS6427756U	1989-02-17

Other References: