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Patent Searching and Data


Title:
IDENTIFIER-PROVIDING DEVICE FOR COMPUTER DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/102029
Kind Code:
A1
Abstract:
The purpose of the present invention is to enable mass production of identifier-providing devices with sufficiently high yield even if the conductive layer pattern thereof has a minimal thickness and a minimum surface area and is formed using a minimum amount of silver paste. An identifier-providing device according to the present invention has a conductive layer pattern formed on the back surface of a substrate serving as an insulator. The silver paste used to form the conductive layer pattern contains only those silver flakes that have a silver particle diameter in the range of 3.0-5.0 μm and that are 100 nm thick or less at the thickest portion thereof and 50 nm thick or less at the thinnest portions thereof. The conductive layer pattern is formed to a film thickness of 10 μm or less by laminating the silver flakes together in the thickness direction. The thinnest portions of the silver flakes forming the conductive layer are fusion-bonded to one another or aggregated and adhered to one another.

Inventors:
MORI MASAYUKI (JP)
KONDO TAKASHI (JP)
TAKAGISHI SUSUMU (JP)
Application Number:
PCT/JP2013/085287
Publication Date:
July 09, 2015
Filing Date:
December 30, 2013
Export Citation:
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Assignee:
GOCCO CO LTD (JP)
International Classes:
G06F3/041
Foreign References:
JP2011134298A2011-07-07
JP2013017590A2013-01-31
JP2010208419A2010-09-24
JP2011134298A2011-07-07
Other References:
See also references of EP 3091424A4
Attorney, Agent or Firm:
MANDA Masayuki (JP)
10, 000 rice fields Masayuki (JP)
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