Title:
IMAGE CAPTURE DEVICE, METHOD FOR MANUFACTURING IMAGE CAPTURE DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/189473
Kind Code:
A1
Abstract:
An image capture device according to an embodiment of the present disclosure comprises: a first substrate comprising a sensor pixel which carries out a photoelectric conversion on a first semiconductor substrate; a second substrate layered on the first substrate and comprising a read circuit which outputs a pixel signal based on a charge outputted from the sensor pixel on a second semiconductor substrate; and a wiring which extends between the first semiconductor substrate and the second semiconductor substrate in a direction parallel to the first semiconductor substrate, and at least a portion of which comprises a layer region in which a semiconductor layer and a metal layer are layered.
Inventors:
MATSUMOTO KOICHI (JP)
Application Number:
PCT/JP2020/010711
Publication Date:
September 24, 2020
Filing Date:
March 12, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/3205; H01L21/768; H01L21/8234; H01L23/522; H01L23/532; H01L27/00; H01L27/088; H01L27/146; H04N5/369
Foreign References:
| JP2014022561A | 2014-02-03 | |||
| JPH11274445A | 1999-10-08 | |||
| JP2015032687A | 2015-02-16 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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