Title:
IMAGE CAPTURE ELEMENT AND IMAGE CAPTURE DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/138914
Kind Code:
A1
Abstract:
The present invention achieves size reduction of an image capture element composed of a stack of a plurality of semiconductor substrates. This image capture element comprises pixels, a pixel circuit, a separating portion, an embedded electrode, and a connecting portion. The pixels each include a photoelectric conversion portion disposed on a first semiconductor substrate to perform photoelectric conversion of incident light, a charge holding portion for holding charge generated by the photoelectric conversion, and a charge transfer portion for transferring the charge from the photoelectric conversion portion to the charge holding portion. The pixel circuit is disposed on a second semiconductor substrate stacked on an upper surface side of the first semiconductor substrate, and generates an image signal on the basis of the charge being held. The separating portion is disposed at a boundary of the pixels. The embedded electrode is disposed by being embedded in the upper surface side of the first semiconductor substrate at the boundary of the pixels overlapping the separating portion, and is connected to the first semiconductor substrate. The connecting portion is connected to the embedded electrode.
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Inventors:
OKAWA TATSUYA (JP)
SUGIMOTO MASATAKA (JP)
SUGIMOTO MASATAKA (JP)
Application Number:
PCT/JP2021/048194
Publication Date:
June 30, 2022
Filing Date:
December 24, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/369; H01L21/336; H01L21/8234; H01L27/088; H01L27/146; H01L29/78; H04N5/374
Domestic Patent References:
| WO2019131965A1 | 2019-07-04 | |||
| WO2018008614A1 | 2018-01-11 | |||
| WO2019131965A1 | 2019-07-04 |
Foreign References:
| JP2020013906A | 2020-01-23 |
Other References:
See also references of EP 4270932A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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