Title:
IMAGE CAPTURING MODULE AND MOLDED PHOTOSENSITIVE ASSEMBLY THEREFOR, MOLDED PHOTOSENSITIVE ASSEMBLY SEMI-FINISHED PRODUCT AND MANUFACTURING METHOD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/186120
Kind Code:
A2
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Inventors:
WANG MINGZHU (CN)
TANAKA TAKEHIKO (JP)
GUO NAN (CN)
CHEN ZHENYU (CN)
ZHAO BOJIE (CN)
MEI ZHEWEN (CN)
HUANG ZHEN (CN)
LUAN ZHONGYU (CN)
TANAKA TAKEHIKO (JP)
GUO NAN (CN)
CHEN ZHENYU (CN)
ZHAO BOJIE (CN)
MEI ZHEWEN (CN)
HUANG ZHEN (CN)
LUAN ZHONGYU (CN)
Application Number:
PCT/CN2017/082000
Publication Date:
November 02, 2017
Filing Date:
April 26, 2017
Export Citation:
Assignee:
NINGBO SUNNY OPOTECH CO LTD (CN)
International Classes:
H04N5/225
Other References:
None
See also references of EP 3481046A4
See also references of EP 3481046A4
Attorney, Agent or Firm:
NINGBO RAYMOND IP AGENCY FIRM (CN)
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