Title:
IMAGE PICKUP ELEMENT PACKAGE, IMAGE PICKUP DEVICE, AND METHOD FOR MANUFACTURING IMAGE PICKUP ELEMENT PACKAGE
Document Type and Number:
WIPO Patent Application WO/2017/090223
Kind Code:
A1
Abstract:
According to one embodiment of the present art, an image pickup element package is provided with a solid-state image pickup element, circuit board, translucent board, and supporting body. The solid-state image pickup element has a light receiving surface, and a rear surface on the reverse side of the light receiving surface. The circuit board supports the rear surface of the solid-state image pickup element. The translucent board faces the light receiving surface. The supporting body has a resin frame section, and a conductor section, and is disposed between the circuit board and the translucent board. The resin frame section has a hollow section in which the solid-state image pickup element is housed, and a fixing section for fixing to a housing section of an image pickup apparatus. The conductor section is integrally provided with the resin frame section, and thermally connects the circuit board and the fixing section to each other.
Inventors:
FUKUDA KEIKI (JP)
Application Number:
PCT/JP2016/004520
Publication Date:
June 01, 2017
Filing Date:
October 07, 2016
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L27/14; H04N5/225; H04N5/335
Foreign References:
| JP2014170819A | 2014-09-18 | |||
| JP2007173483A | 2007-07-05 | |||
| JP2015084377A | 2015-04-30 |
Attorney, Agent or Firm:
OMORI, Junichi (JP)
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