Title:
IMAGE SENSOR CHIP PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/046042
Kind Code:
A1
Abstract:
An image sensor chip packaging structure. The image sensor chip packaging structure comprises: a substrate (110); an image sensor chip (120) located on one side of the substrate, the image sensor chip (120) comprising a photosensitive area (121) and at least two first pads (122); a cofferdam layer (130) located between the photosensitive area (121) and the first pads (122), the material of the cofferdam layer (130) comprising silicon; a light-transmitting cover plate (140) located on the side of the cofferdam layer (130) away from the image sensor chip (120), a cavity (123) being formed between the light-transmitting cover plate (140), the cofferdam layer (130), and the image sensor chip (120), and the photosensitive area (121) being located in the cavity (123); and a packaging layer (150) located on the side of the image sensor chip (120) away from the substrate (110), the packaging layer (150) covering the substrate (110) and the image sensor chip (120), and the surface of the packaging layer (150) away from the substrate (110) being flush with the surface of the light-transmitting cover plate (140) away from the substrate (110).
Inventors:
ZHAO FEILONG (CN)
FANG YULIANG (CN)
WANG YEYE (CN)
LI YUANYUAN (CN)
REN PENG (CN)
FANG YULIANG (CN)
WANG YEYE (CN)
LI YUANYUAN (CN)
REN PENG (CN)
Application Number:
PCT/CN2023/111482
Publication Date:
March 07, 2024
Filing Date:
August 07, 2023
Export Citation:
Assignee:
GUANGDONG 3D SEMI CO LTD (CN)
International Classes:
H01L23/10
Foreign References:
| CN218677118U | 2023-03-21 | |||
| CN110828446A | 2020-02-21 | |||
| CN111009537A | 2020-04-14 | |||
| US20220085086A1 | 2022-03-17 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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