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Patent Searching and Data


Title:
IMAGE SENSOR MANUFACTURING METHOD AND IMAGE SENSOR
Document Type and Number:
WIPO Patent Application WO/2023/204050
Kind Code:
A1
Abstract:
In order to improve the planarity of the surface of an image sensor for forming a conveyance path for paper sheets, the present invention involves manufacturing an image sensor having a configuration in which a case having accommodated therein a light source part for emitting light to an imaging subject and a light reception part for receiving light from the imaging subject is furnished with a cover that includes a transmission member allowing transmission therethrough of light emitted from the light source part and light received by the light reception part and that includes a frame member which supports the transmission member, the manufacturing comprising: a placement step for placing, on an adhesive tape fixed on a plane, the transmission member and the frame member in a prescribed positional relationship; a first pressure-bonding step for pressing the transmission member onto the adhesive tape and making the same tightly adhere to the adhesive tape; a second pressure-bonding step for pressing the frame member onto the adhesive tape and making the same tightly adhere to the adhesive tape; a bonding step for filling a bonding agent in a gap between the frame member and the transmission member tightly adhered to the adhesive tape; and a releasing step for releasing the adhesive tape from the transmission member, the frame member, and the bonding agent.

Inventors:
TAKEZAWA KEIGO (JP)
MATSUMOTO YUKI (JP)
KOFUJI SADAYUKI (JP)
Application Number:
PCT/JP2023/014357
Publication Date:
October 26, 2023
Filing Date:
April 07, 2023
Export Citation:
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Assignee:
GLORY KOGYO KK (JP)
International Classes:
H04N1/031; H01L27/146; H04N1/028; H04N1/04
Foreign References:
JP2012170156A2012-09-06
JP2015188241A2015-10-29
JP2016127552A2016-07-11
Attorney, Agent or Firm:
NAKATSUJI, Shiro et al. (JP)
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