Title:
IMAGING DEVICE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/003732
Kind Code:
A1
Abstract:
Provided are an imaging device and an electronic device with which, even when an image sensor is mounted on a wiring substrate, it is possible to assemble in a housing, with high precision, the wiring substrate on which the image sensor is mounted. The imaging device is provided comprising a sensor chip and a wiring substrate having a glass base material. The imaging device is joined to the sensor chip and/or the wiring substrate via a bump unit constituted from a plurality of bumps. Each of the bumps, among the plurality of bumps, is formed from an electroconductive member having substantially the same composition.
Inventors:
HOGYOKU SUSUMU (JP)
Application Number:
PCT/JP2019/017840
Publication Date:
January 02, 2020
Filing Date:
April 26, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/60; H01L27/146; H01L23/02; H01L23/08; H04N5/225; H04N5/369; H05K1/18
Foreign References:
| JP2017139316A | 2017-08-10 | |||
| JP2004335660A | 2004-11-25 | |||
| JP2011086670A | 2011-04-28 |
Attorney, Agent or Firm:
WATANABE Kaoru (JP)
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