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Title:
IMAGING DEVICE, MANUFACTURING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/025742
Kind Code:
A1
Abstract:
The present technology pertains to an imaging device, a manufacturing device, a manufacturing method, and an electronic device, wherein the imaging device can be made more compact and thinner. The imaging device is equipped with: a first substrate in the center portion of which an imaging element is mounted; components mounted in a portion on the outer periphery of the central portion of the first substrate; and a member in which the components are embedded, and which is formed on the outer peripheral portion by a molding method. The imaging element is further equipped with a lens barrel that holds a lens, and is configured such that a frame for supporting the portion that includes the lens barrel is positioned on the aforementioned member. The frame is configured so as to include an infrared cut filter (IRCF). The present technology can be applied to an imaging device.

Inventors:
OTANI HIDETSUGU (JP)
KISHIGAMI YUUJI (JP)
Application Number:
PCT/JP2014/071035
Publication Date:
February 26, 2015
Filing Date:
August 08, 2014
Export Citation:
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Assignee:
SONY CORP (JP)
International Classes:
H04N5/225; G02B7/02; G03B11/00; G03B17/02; H04N5/335; G02B7/04
Foreign References:
JP2011086670A2011-04-28
JPH09130683A1997-05-16
JP2013070270A2013-04-18
JP2006166398A2006-06-22
JP2008312104A2008-12-25
JP2010041213A2010-02-18
JP2006276463A2006-10-12
JP2006287533A2006-10-19
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
Nishikawa 孝 (JP)
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