Title:
IMAGING DEVICE AND METHOD FOR MANUFACTURING IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/131904
Kind Code:
A1
Abstract:
Provided are an imaging device having superior optical characteristics, a method for manufacturing an imaging device, and an electronic apparatus at a lower cost. The imaging device according to the present disclosure is provided with an imaging element (10) including a solid-state imaging element (100) having formed a light-receiving surface on which light receiving elements are arrayed in a two-dimensional lattice shape, and protective members (101, 102) disposed on a light-receiving surface side with respect to the solid-state imaging element. The imaging element has a curved section curving from the light-receiving surface of the solid-state imaging element toward the surface on the opposite side to the light-receiving surface.
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Inventors:
KIMURA KATSUJI (JP)
SAKIOKA YOUJI (JP)
SEKI HIROKAZU (JP)
SAKIOKA YOUJI (JP)
SEKI HIROKAZU (JP)
Application Number:
PCT/JP2020/046758
Publication Date:
July 01, 2021
Filing Date:
December 15, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/225; G03B17/02; H01L27/146; H04N5/369
Foreign References:
| JP2001284564A | 2001-10-12 | |||
| JP2008131228A | 2008-06-05 | |||
| JP2008219854A | 2008-09-18 | |||
| JP2017022313A | 2017-01-26 | |||
| JP2013085212A | 2013-05-09 | |||
| JP2004297683A | 2004-10-21 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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