Title:
IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/170936
Kind Code:
A1
Abstract:
This imaging device comprises: a first substrate having sensor pixels that perform photoelectric conversion on a first semiconductor substrate; a second substrate that is laminated on the first substrate and has a read circuit that outputs pixel signals on the basis of the charge output from the sensor pixels, to a second semiconductor substrate; a first insulating layer provided between the first semiconductor substrate and the second semiconductor substrate; and a second insulating layer provided between the first semiconductor substrate and the second semiconductor substrate and having a lower film density than the first insulating layer.
Inventors:
FUJII NOBUTOSHI (JP)
HIRAMATSU KATSUNORI (JP)
NAKAZAWA KEIICHI (JP)
HIRAMATSU KATSUNORI (JP)
NAKAZAWA KEIICHI (JP)
Application Number:
PCT/JP2020/005581
Publication Date:
August 27, 2020
Filing Date:
February 13, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L21/768; H01L21/3205; H01L21/822; H01L23/522; H01L23/532; H01L27/04; H01L27/146; H04N5/369; H04N5/374
Domestic Patent References:
| WO2011077580A1 | 2011-06-30 | |||
| WO2013190759A1 | 2013-12-27 | |||
| WO2018186192A1 | 2018-10-11 |
Foreign References:
| JP2011114326A | 2011-06-09 | |||
| JP2014022561A | 2014-02-03 | |||
| JP2015135938A | 2015-07-27 | |||
| JP2016009739A | 2016-01-18 | |||
| JP2018125325A | 2018-08-09 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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