Title:
IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/107420
Kind Code:
A1
Abstract:
An imaging device according to an embodiment of the present disclosure comprises: pixels in which a plurality of photoelectric conversion regions are formed in parallel in a surface of a semiconductor substrate; a first transistor which is provided over each of the plurality of photoelectric conversion regions and extracts charges generated in the plurality of photoelectric conversion regions; first separation parts provided so as to be continuous around the periphery of the plurality of photoelectric conversion regions; and second separation parts which are provided adjacent to the first separation regions between the adjacent photoelectric conversion regions, and to which a predetermined electric potential is indirectly applied by individually applying electric potentials to a lower section of the first transistor and to the first separation parts.
More Like This:
JP6530053 | Solid-state image sensor |
JPH11313334 | SOLID-STATE IMAGE PICKUP DEVICE |
WO/2012/173029 | IMAGE SENSOR, IMAGE CAPTURING APPARATUS, AND FORMING METHOD |
Inventors:
SAITO HIROMASA (JP)
Application Number:
PCT/JP2021/032661
Publication Date:
May 27, 2022
Filing Date:
September 06, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/369; H01L27/146; H04N5/374
Domestic Patent References:
WO2020013130A1 | 2020-01-16 |
Foreign References:
JP2013175494A | 2013-09-05 | |||
JP2013041890A | 2013-02-28 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
Download PDF: