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Title:
IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/105935
Kind Code:
A1
Abstract:
An imaging device according to an embodiment of the present disclosure comprises: a plurality of first bonded electrodes provided on an interface of a first substrate with a second substrate and respectively electrically connected to a plurality of floating diffusion layers; and a plurality of second bonded electrodes provided on an interface of the second substrate with the first substrate and respectively bonded with the plurality of first bonded electrodes. The first substrate and the second substrate are stacked. A plurality of floating diffusion layers respectively electrically connected to one first bonded electrodes and second bonded electrodes bonded to each other, and to another first bonded electrodes and second bonded electrodes bonded to each other and adjacent to the first bonded electrodes and second bonded electrodes in the row direction, have temporarily retained charges read therefrom at mutually different timings.

Inventors:
MATSUO JUNICHI (JP)
OTAKE YUSUKE (JP)
Application Number:
PCT/JP2022/038801
Publication Date:
June 15, 2023
Filing Date:
October 18, 2022
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146
Foreign References:
JP2020088380A2020-06-04
JP2017046260A2017-03-02
JP2018064758A2018-04-26
JP2003204054A2003-07-18
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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