Title:
IMAGING ELEMENT AND METHOD FOR MANUFACTURING IMAGING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2021/153628
Kind Code:
A1
Abstract:
An imaging element according to one embodiment of the present disclosure comprises: a semiconductor substrate having a valid pixel region in which a plurality of pixels are arranged and a peripheral region provided around the valid pixel region; a first electrode that is provided on the light-receiving surface side of the semiconductor substrate and that comprises a plurality of electrodes; a second electrode that is arranged opposite the first electrode; an organic photoelectric conversion unit that includes a charge storage layer and an organic photoelectric conversion layer that are provided stacked in order between the first electrode and the second electrode and that extend to the valid pixel region; and a sealing layer obtained by stacking, above the organic photoelectric conversion unit, a first layer and a second layer which have mutually different etching rates.
Inventors:
FUJII NOBUTOSHI (JP)
MURATA KENICHI (JP)
SAITO SUGURU (JP)
TSUJIAI HIDEKI (JP)
OKAMOTO MASAKI (JP)
SHIRASU YOSHIKI (JP)
MURATA KENICHI (JP)
SAITO SUGURU (JP)
TSUJIAI HIDEKI (JP)
OKAMOTO MASAKI (JP)
SHIRASU YOSHIKI (JP)
Application Number:
PCT/JP2021/002887
Publication Date:
August 05, 2021
Filing Date:
January 27, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L51/42; H01L27/146; H01L31/10
Domestic Patent References:
| WO2019058995A1 | 2019-03-28 |
Foreign References:
| JP2018073760A | 2018-05-10 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
Download PDF: