Title:
IMAGING MODULE
Document Type and Number:
WIPO Patent Application WO/2018/221075
Kind Code:
A1
Abstract:
This imaging module (2) is provided with: a solid-state imaging element (4) that has a light-receiving surface (26) on which a light-receiving part (24) is disposed; a backside electrode (8) that is disposed on a second main surface (32) which is on the opposite side of the light-receiving surface (26) of the solid-state imaging element (4); a hard substrate (10) which is disposed facing the second main surface (32) of the solid-state imaging element (4) and is electrically connected to the backside electrode (8), the hard substrate (10) having a mounting surface (44) parallel to the light-receiving surface (26), and side surfaces (56a) that are formed in the normal direction with respect to the light-receiving surface (26); an electronic component (14) that is mounted on the mounting surface (44) of the hard substrate (10); and lead-out electrodes (18) disposed on the side surfaces (56) of the hard substrate (10) and configured to electrically connect wiring cables (20).
Inventors:
KOBAYASHI MASATO
TAKAYAMA YOSHIKI
KAWABATA TAKESHI
SANO HIKARI
TAKAYAMA YOSHIKI
KAWABATA TAKESHI
SANO HIKARI
Application Number:
PCT/JP2018/016518
Publication Date:
December 06, 2018
Filing Date:
April 24, 2018
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H04N5/369; A61B1/04; H01L27/146; H04N5/225; A61B1/05
Domestic Patent References:
| WO2017057291A1 | 2017-04-06 |
Foreign References:
| JP2009027709A | 2009-02-05 | |||
| JP2015062555A | 2015-04-09 | |||
| JP2014000314A | 2014-01-09 | |||
| JP2000209472A | 2000-07-28 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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