IMAGING UNIT, IMAGING MODULE, AND ENDOSCOPE

Title:

IMAGING UNIT, IMAGING MODULE, AND ENDOSCOPE

Document Type and Number:

WIPO Patent Application WO/2017/130886

Kind Code:

A1

Abstract:

Provided are an imaging unit, an imaging module, and an endoscope that are more compact and to which a plurality of electronic components can be easily and precisely mounted. An imaging unit 10 according to the present invention is characterized by comprising a semiconductor package 20; a circuit substrate 30 that has a main body section 31 on which a connection land is formed, and an attachment section 32 protruding from a back surface of the main body section 31 and having cable connection electrodes formed on at least two facing side surfaces among protruding side surfaces; electronic components 51, 52; and a plurality of cables 60a-60c, wherein, in the attachment section 32, a center plane a1 between the two side surfaces on which the cable connection electrodes are formed in a facing manner is shifted away from a center plane a2 and protrudes from the main body section 31, said center plane a2 being between side surfaces of the semiconductor package 20 that are parallel to the two side surfaces of the attachment section 32, and at least one side surface is perpendicular to the back surface of the main body section 31 and makes a stepped shape, and an electronic component mounting region R is located next to the attachment section 32 on the back surface of the main body section 31.

Inventors:

MOTOHARA HIROYUKI (JP)
KUSANO YASUHIRO (JP)

Application Number:

PCT/JP2017/002064

Publication Date:

August 03, 2017

Filing Date:

January 23, 2017

Export Citation:

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Assignee:

OLYMPUS CORP (JP)

International Classes:

H04N5/225; A61B1/04; G02B23/24; H01L27/14; H04N5/369

Foreign References:

JP2015062555A	2015-04-09
JPS63240825A	1988-10-06
JP2005278760A	2005-10-13
JP2006314582A	2006-11-24

Other References: