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Patent Searching and Data


Title:
IMIDE RESIN FILM PRODUCTION SYSTEM AND IMIDE RESIN FILM PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2015/194548
Kind Code:
A1
Abstract:
 The present invention efficiently produces a high-quality imide resin film with outstanding porosity. This imide resin film production system comprises: a film-forming unit (70) which fires an unfired film containing polyamic acid, polyimide, polyamide-imide, or polyamide resin material and microparticles, and removes the microparticles from the fired film to form a porous resin film; and a chemical etching unit (40) which dissolves part of the porous resin film.

Inventors:
KAWAMURA YOSHITSUGU (JP)
MIZUKI HIDEYUKI (JP)
SUGIYAMA SHINYA (JP)
Application Number:
PCT/JP2015/067296
Publication Date:
December 23, 2015
Filing Date:
June 16, 2015
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
C08J9/26; B29C41/24; H01M50/489
Domestic Patent References:
WO2013084368A12013-06-13
Foreign References:
JP2012167181A2012-09-06
JPH1121369A1999-01-26
JP2011060539A2011-03-24
Attorney, Agent or Firm:
NISHI, KAZUYA (JP)
West Kazuya (JP)
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