IMMERSION EXPOSURE PROCESS-USE RESIST PROTECTION FILM FORMING MATERIAL, COMPOSITE FILM, AND RESIST PATTERN FORMING METHOD

Title:

IMMERSION EXPOSURE PROCESS-USE RESIST PROTECTION FILM FORMING MATERIAL, COMPOSITE FILM, AND RESIST PATTERN FORMING METHOD

Document Type and Number:

WIPO Patent Application WO/2004/074937

Kind Code:

A1

Abstract:

An immersion exposure process-use resist protection film forming material formed on a resist film, the material having characteristics of being transparent to an exposure light, having practically no miscibility with an immersion exposure-use liquid and causing no mixing with the resist film; a protection film formed by this material; a composite film having the resist film; and a resist pattern forming method using them. These can prevent the degeneration of a resist film during immersion exposing and the degeneration of a liquid being used at the same time, and can form a high-resolution resist pattern using immersion exposing.

Inventors:

HIRAYAMA TAKU (JP)
TAKASU RYOICHI (JP)
SATO MITSURU (JP)
WAKIYA KAZUMASA (JP)
YOSHIDA MASAAKI (JP)
TAMURA KOKI (JP)

Application Number:

PCT/JP2004/001956

Publication Date:

September 02, 2004

Filing Date:

February 20, 2004

Export Citation:

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Assignee:

TOKYO OHKA KOGYO CO LTD (JP)
HIRAYAMA TAKU (JP)
TAKASU RYOICHI (JP)
SATO MITSURU (JP)
WAKIYA KAZUMASA (JP)
YOSHIDA MASAAKI (JP)
TAMURA KOKI (JP)

International Classes:

G03F7/039; G03F7/11; G03F7/20; (IPC1-7): G03F7/11; G03F7/039; H01L21/027

Domestic Patent References:

WO1999049504A1

1999-09-30

Foreign References:

JPH11352697A	1999-12-24
JPH0876382A	1996-03-22
JPH07253674A	1995-10-03
JPS6265326A	1987-03-24
JPH10303114A	1998-11-13
US6136505A	2000-10-24

Other References: