Title:
IMPEDANCE CONVERTER
Document Type and Number:
WIPO Patent Application WO/2023/238376
Kind Code:
A1
Abstract:
A microstrip line (1) is composed of a dielectric board (10), a ground layer that is formed on the back surface of the board (10), and a signal line (12). A microstrip line (2) is composed of the board (10), the ground layer that is formed on the back surface of the board (10), and a signal line (13). A grounded coplanar line (3) is composed of the board (10), a line (12), ground layers (14) formed on both sides of the line (12), and ground layers (15) formed on both sides of the line (13). A grounded coplanar line (4) is composed of the board (10), the line (13), the ground layers (15) and the ground layers (14).
Inventors:
MUTO MIWA (JP)
NAKAJIMA FUMITO (JP)
NAKAJIMA FUMITO (JP)
Application Number:
PCT/JP2022/023436
Publication Date:
December 14, 2023
Filing Date:
June 10, 2022
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE (JP)
International Classes:
H01P5/02
Domestic Patent References:
| WO2021220460A1 | 2021-11-04 |
Foreign References:
| JPH1041637A | 1998-02-13 | |||
| JP2003069239A | 2003-03-07 | |||
| JP2005101587A | 2005-04-14 |
Attorney, Agent or Firm:
YAMAKAWA, Shigeki et al. (JP)
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