Title:
IMPEDANCE MATCHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/230782
Kind Code:
A1
Abstract:
This impedance matching device (2A) is connected between plasma generation electrodes (51), (52) and a high-frequency power source (1) that selectively supplies high-frequency power at multiple frequencies, the impedance matching device being equipped with: a plurality of matching units (31), (32) which are provided in correspondence to high-frequency power at the respective multiple frequencies in order to cause the impedance of the high-frequency power source (1) to be matched to the impedance of a plasma load; and a branching unit (20) which demultiplexes the high-frequency power having the respective multiple frequencies and being outputted from the high-frequency power source (1), and outputs the high-frequency power to one of the matching units (31), (32) corresponding to the high-frequency power having the demultiplexing-derived frequency.
Inventors:
MATSUNAGA MOTOMU (JP)
Application Number:
PCT/JP2020/018970
Publication Date:
November 19, 2020
Filing Date:
May 12, 2020
Export Citation:
Assignee:
TOKYO KEIKI INC (JP)
International Classes:
H05H1/24; H03H7/40; H03H7/46; H05H1/46
Domestic Patent References:
| WO2012035842A1 | 2012-03-22 |
Foreign References:
| JP2019021803A | 2019-02-07 | |||
| JP2001321662A | 2001-11-20 | |||
| JP2005328327A | 2005-11-24 | |||
| JP2012124184A | 2012-06-28 | |||
| JP2016134461A | 2016-07-25 |
Attorney, Agent or Firm:
AKAZAWA, Hideo (JP)
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