Title:
IMPLANTATION WHEEL FOR FORMING A PLANE OF WEAKNESS IN A PLURALITY OF DONOR WAFERS
Document Type and Number:
WIPO Patent Application WO/2023/217845
Kind Code:
A1
Abstract:
The invention relates to an implantation wheel (1) for forming a plane of weakness in a plurality of donor wafers (3), the wheel (1) comprising a main disc (1a) and a plurality of wafer supports (2) arranged on one face of the main disc (1a), each wafer support (2) having a host surface on which a so-called "rear" face of a donor wafer (3) is placed. According to a first aspect, the host surface at least partially comprises a superficial elastomer layer (2b), the superficial elastomer layer (2b) having a dimension at least equal to that of the rear face of the donor wafer (3). According to another aspect, each host surface of the plurality of wafer supports (2) has a convex shape, the convex shape being chosen to correspond to the shape of the donor wafer as the latter deforms under the effect of temperature.
Inventors:
NADIA BEN MOHAMED (FR)
PETIT OLIVIER (FR)
COLAS FRANCK (FR)
RADISSON DAMIEN (FR)
RIEUTORD FRANÇOIS (FR)
PETIT OLIVIER (FR)
COLAS FRANCK (FR)
RADISSON DAMIEN (FR)
RIEUTORD FRANÇOIS (FR)
Application Number:
PCT/EP2023/062394
Publication Date:
November 16, 2023
Filing Date:
May 10, 2023
Export Citation:
Assignee:
SOITEC SILICON ON INSULATOR (FR)
International Classes:
H01L21/687; H01L21/67
Foreign References:
| US20140235007A1 | 2014-08-21 | |||
| US20150275364A1 | 2015-10-01 | |||
| US20160300753A1 | 2016-10-13 | |||
| US20200013643A1 | 2020-01-09 | |||
| US20170067162A1 | 2017-03-09 | |||
| US20150340254A1 | 2015-11-26 | |||
| US20200186117A1 | 2020-06-11 | |||
| US20070158583A1 | 2007-07-12 | |||
| US4832781A | 1989-05-23 | |||
| US5040484A | 1991-08-20 |
Attorney, Agent or Firm:
IP TRUST (FR)
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