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Patent Searching and Data


Title:
IMPRINT AND TRANSFERRING METHOD FOR TRANSFERRING LIGHT EMITTING DIODE
Document Type and Number:
WIPO Patent Application WO/2022/061512
Kind Code:
A1
Abstract:
The present invention provides an imprint and transferring method for transferring a light emitting diode. The imprint is used for mass transfer of light emitting diode chiplets, and comprises: a power supply that is internally provided or externally connected, a charge used for providing a selectable electrical property, a first conductive substrate and a second conductive substrate which are oppositely arranged, and an electro-elastic dielectric located between the two and directly connected to the two. When a charge is introduced to the first conductive substrate and the second conductive substrate to generate a voltage, the electro-elastic dielectric has a strain change within an electric field formed by the voltage; the second conductive substrate has a plurality of through holes; an imprint pattern is set by using the through holes, and transfer cost is reduced by using electroactivity of the imprint, thereby improving the reliability and yield of chiplet transfer.

Inventors:
SHI JUNPENG (CN)
HSU CHEN-KE (CN)
LIU TUNG-KAI (CN)
YU CHANGCHIN (CN)
Application Number:
PCT/CN2020/116828
Publication Date:
March 31, 2022
Filing Date:
September 22, 2020
Export Citation:
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Assignee:
QUANZHOU SANAN SEMICONDUCTOR TECH CO LTD (CN)
International Classes:
H01L21/677; H01L21/68; H01L33/00
Foreign References:
CN109449260A2019-03-08
CN104538344A2015-04-22
CN109920754A2019-06-21
CN109950194A2019-06-28
CN109411392A2019-03-01
JP2002182580A2002-06-26
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