Title:
IMPROVED METHOD AND APPARATUS FOR OPTICALLY TRANSPARENT VIA FILLING
Document Type and Number:
WIPO Patent Application WO/2010/022248
Kind Code:
A3
Abstract:
A method and apparatus for filling a via 16 with transparent material 18 is presented, including the steps of providing a panel 10 having a via 16, occluding the via 16 with transparent material 18 in a workable state so that a portion of the occluding material 18 is internal to the via 16 and a portion of the material is external 54 to the via 16. The external 54 and internal portions are separated so the transparent filler material 18, when set, forms a smooth and featureless surface 12. This causes the filled via 16 to have a substantially even and uniform appearance over a wide range of viewing angles when lit.
Inventors:
SIMENSON GLENN F (US)
ANTONI WILLIAM (US)
COHEN STEVE (US)
HOWERTON JEFFREY (US)
ANTONI WILLIAM (US)
COHEN STEVE (US)
HOWERTON JEFFREY (US)
Application Number:
PCT/US2009/054485
Publication Date:
May 20, 2010
Filing Date:
August 20, 2009
Export Citation:
Assignee:
ELECTRO SCIENT IND INC (US)
SIMENSON GLENN F (US)
ANTONI WILLIAM (US)
COHEN STEVE (US)
HOWERTON JEFFREY (US)
SIMENSON GLENN F (US)
ANTONI WILLIAM (US)
COHEN STEVE (US)
HOWERTON JEFFREY (US)
International Classes:
F21V17/00; B29D11/00; G02B6/10
Foreign References:
| US20070291496A1 | 2007-12-20 | |||
| US6416844B1 | 2002-07-09 | |||
| JPH07201260A | 1995-08-04 | |||
| US4155972A | 1979-05-22 |
Attorney, Agent or Firm:
LEONARD, Patrick, F. (Inc.C/o Legal Dept.,13900 NW Science Park Driv, Portland OR, US)
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