CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to U.S. Provisional Application No. 62/252,159 filed on November 6, 2015, the contents of which are incorporated herein by reference.

TECHNICAL FIELD

[0002] The following relates generally to solar panels and more particularly to an in- frame or on-frame electronics assembly for such solar panels.

DESCRIPTION OF THE RELATED ART

[0003] Currently, photovoltaic solar panels generate direct current (DC) power, which is output to an inverter. The inverter converts the DC output to alternating current (AC) power, which is useable by the grid and general applications. Until recently, such solar panels were often strung together in series and then inverted at a "string" level using a higher voltage which has been found to lend itself to greater conversion efficiency.

[0004] There are felt to be disadvantages to string level inversion which can include: panel mismatch due to regular panel degradation over time, and shadowing by soil or other obstructions of a portion of a panel or panels (which can lead to degradation of power of the entire string, since the panels are typically connected in series). The solar panels can also be limited in the number of panels which may be strung together by various regulatory and practical constraints, which can place additional limits on the efficiency of the inversion.

[0005] Recently, there have been attempts to utilize "micro-inverters", which seek to do the inversion at a panel level rather than at a string level. These micro-inverters are separate devices that can be mounted on a rack in proximity to the solar panel they are connected to, or directly mounted to the frame of the solar panel. If the micro-inverters are shipped from a manufacturer or a distributor pre-attached to the solar panel with which they are to be used, they are often marketed as an "AC Panel". However, these assemblies in reality consist of two separate and yet-to-be connected devices. There have been found to be difficulties with micro-inverters. For example, these devices can be expensive due to high component counts, a large size and weight relative to the size of a typical solar panel junction box, thermal dissipation requirements to avoid creating hot spots in the panel, and the associated grounding requirements they have. These devices are also found to be less efficient than string inverters.

[0006] Another attempt to overcome some of the technical challenges of using string inverters is to put maximum power point tracking at a panel level, but still do the inversion at the string level. This configuration can solve the mismatch and soiling and power degradation issues while allowing for the use of the more cost-effective and typically more efficient string inverters. These devices, commonly referred to as "optimizers" are typically smaller than micro inverters and there are some versions of these available to the market which will fit inside the footprint of a junction box solution. The optimizers are also available as add-ons that may be shipped with a panel by mounting the separate unit to the panel, often by mounting on the frame, or as separate units mounted on the mounting rails to which panels are often connected. As electronic devices they may also need to be housed in a sealed enclosure, may require grounding, and may also have some degree of thermal load associated with them.

[0007] Other panel-level electronics devices may include, for example, simple panel- level monitoring of output characteristics, which may or may not be reported to other devices, panel identification devices, and rapid-shutdown devices which also may or may not communicate or report to other devices. These devices may also require enclosures, protection from the elements, grounding, and thermal dissipation.

[0008] All of the above-described devices may require housing and enclosure to protect them from the elements including UV and other radiation, water, wind, rain, snow, etc.; over the life of the device. These devices also typically require thermal management, and grounding, and also be configured to comply with EMI, EMC, and ESD requirements. These considerations are known to have at least some level of cost associated with them.

[0009] It is an object of the following to address at least one of the above-noted disadvantages.

SUMMARY

[0010] The following describes an assembly and system that utilizes the existing frame of a solar panel to provide at least part of the protective enclosure, as well as the grounding and thermal requirements where applicable.

[0011] In one aspect, there is provided a frame for a solar panel, the frame providing at least one wall of an enclosure onto which electronics for the solar panel can be supported.

[0012] In another aspect, there is provided an in-frame electronics assembly for the frame above, the assembly comprising the frame, the electronics in the enclosure, at least one connection between the electronics and the solar panel, at least one output, and a closeable opening for enabling access to the electronics.

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Embodiments will now be described by way of example only with reference to the appended drawings wherein: [0014] FIG. 1 A is a perspective view of a solar panel mounted on a rack support;

[0015] FIG. 1 B is a perspective view of a solar panel mounted to a rooftop via rails;

[0016] FIG. 2 is a perspective view of the rear side of a solar panel in one configuration for a junction box;

[0017] FIG. 3 is a perspective view showing an electronics enclosure integrated into a frame of a solar panel in which the frame is used as a lid for the enclosure;

[0018] FIG. 4 is a perspective view showing an electronics enclosure integrated into a frame of a solar panel in which the frame provides five walls of the enclosure with a separate lid shown transparently;

[0019] FIG. 5 is a perspective view showing an electronics enclosure integrated into a frame of a solar panel in which the frame provides five walls of the enclosure with a separate lid shown in solid;

[0020] FIG. 6 is a perspective view showing an electronics enclosure integrated into a frame of a solar panel in which an operational or status light or other visual indicator for the electronics is incorporated into the frame and visible to the exterior thereof;

[0021] FIG. 7 is a schematic profile view of an in-frame configuration for housing electronics;

[0022] FIG. 8 is a schematic profile view of an on-frame configuration for housing electronics;

[0023] FIG. 9 is a schematic profile view of another in-frame configuration for housing electronics;

[0024] FIG. 10 is a schematic profile view of another in-frame configuration for housing electronics;

[0025] FIG. 1 1 is a schematic profile view of yet another in-frame configuration for housing electronics;

[0026] FIG. 12 is a perspective view of the rear side of a solar panel in another configuration for a junction box;

[0027] FIG. 13 is a schematic profile view of the junction box configuration shown in FIG. 12.

DETAILED DESCRIPTION

[0028] The following provides a solution that uses the frame which is already present on many solar photovoltaic (PV) panels as a part of, or as the entirety of, the protective enclosure, grounding, and thermal solutions for reasons of performance, cost, and functionality. Other configurations are shown in which the frame provides support for an enclosure or is modified to provide part or an entirety of such enclosures. These solutions can be configured to work with any electronics (e.g. micro inverter, etc.) that can fit into the form factor of a frame, or any solar panel frame solution that is modified, adapted or designed, to suit the requirements of mounting and/or housing the electronics in one or more of the various configurations described herein. For example, FIG. 1 A illustrates an example of a solar panel 10 mounted on a rack 12, e.g., that can be deployed in a suitable orientation and mounted to the ground or other surface. The solar panel 10 includes a frame 14, which is adapted to include or otherwise provide an electronics enclosure as discussed in greater detail below. FIG. 1 B illustrates another example in which a set of rails 16 is used as racking to mount solar panels 10 to a rooftop 18.

[0029] It has also been recognized that there is a trend in the solar panel industry to eliminate the racking upon which panels normally rest, and mount the panels directly to the roof or other structure. A robust frame can also be used, which acts as both a frame and a racking structure to join multiple panels together for additional stiffness and other advantages which generally lead to faster, simpler installation and cost reductions. The solution described herein can also be adapted to the mounting of electronics inside such stiff frame / rack elements or any other frame component used by a solar panel, according to the same principles described herein.

[0030] The following principles are therefore applicable to all manifestations of electronics partially or entirely inside, or otherwise supported by the frame of the solar panel, or using the frame of the panel as any part of the enclosure of the electronics device. This can include using the frame as an enclosure lid or any other of the walls the device would need to enclose the electronics, for example, akin to typical 5-wall bathtub type enclosures commonly found in outdoor enclosures for electronics, 4-wall triangular and 3-face semicircular versions of the same.

[0031] The following principles are also applicable to using the frame as an enclosure element which includes other functionality such as visual indicator lights in any fashion, which can be configured to be provided and be visible on one or more faces. Other features that are applicable within the following description include bulkhead connector mounting for AC or DC outputs directly to or from the enclosure attached to/in the frame, and an egress portion on the back of the solar panel to the outside of the solar panel for a cable, connector, or other output of the electronics. [0032] It can also be appreciated that while solar panel frames are typically made of an Aluminum alloy in current implementations, the principles discussed here are also applicable to other materials that could be used for solar panel frames including, for example, various steel alloys, other metals, and composites and plastics, whether they are treated or not in special ways to make them suitable for electronics enclosures and panel frame elements. The principles also cover the use of an element that encloses about the laminate in the manner of a solar panel frame 14 on a single or plurality of edges, for "frameless" panels and glass / glass laminate constructions. In any of these implementations, a light or visual indicator can be mounted on the frame and be visible to a user, installer, or operator.

[0033] As discussed above, the assembly described herein can apply be applied to the frame / rack combination that is becoming popular with such methods as the ZEP frame system, Spice Rack, and others, where the frame 14 contains structural elements of racking and connecting multiple panels together for mounting efficiencies.

[0034] The assembly can also be configured to be capable of getting cables out from the back of the panel through the frame 14. Because the electronics themselves are inside or exposed to the frame elements from the inside, or supported near from frame on the laminate, this differs from previous implementations, and the egress point of the output may be on the outside of the frame 14 as well as inside the frame 14. The egress could instead be through the end of the frame 14 on the side of the panel at 90° to the frame element the electronics are mounted inside.

[0035] FIGS. 2 through 1 1 illustrate a various implementations of the assembly described herein, but should be considered non-limiting. In FIG. 2, it can be seen that a panel junction box 26 is supported on the rear side of the laminate 25 that is enclosed by the frame 14. The junction box is connected to in-frame electronics (not shown in FIG. 2) by way of a pair of inputs 24.

[0036] In FIG. 3, it can be seen that the frame 14 is used as a lid for an enclosure 20 that is installed in a cavity 22 within the frame 14. It may be noted from FIG. 3 that either the "lip" of the frame 14 or the inside wall of the frame 14 could be a suitable lid for the depicted electronic device and its enclosure 20. The enclosure 20 is adapted to receive the inputs 24 from the panel junction box 26, and is depicted with a single output 28, such as may be found on a long, narrow micro inverter solution. It can be appreciated that two outputs would be used for a DC-DC optimizer or other type of pass-through application.

[0037] It can be appreciated that the junction box 26 and panel DC outputs, which lead to inputs 24 can be eliminated by having the busbar outputs from the solar panel 10 be fed directly into the cavity 22 inside the frame to connect into the enclosure 20 and its electronics. This would be advantageous to further reduce the number of parts required.

[0038] FIG. 4 shows a circuit board 30 mounted on the inside surface of the outer wall of the frame 14. The circuit board 30 may be mounted conveniently on any of the walls of the cavity 22 inside the frame 14. Connectors 24 are shown on the lid 32 of the device 20. The connectors 24 may also be mounted on any face of the device 20, and of the frame 14 specifically. This figure shows the small end walls inside the frame 14 as being solid. The small end walls may be created by various techniques, including, for example, bending the cut-out material down and welding it in place with a continuous or discontinuous seam to create sealed and unsealed joints. Other techniques include inserting other wall material in and attaching it with various attaching techniques, including welding, soldering, epoxy and other adhesives, and sealants. It can be appreciated that a pre-cast part 20 can also be inserted into the cavity 22 for space efficiency and other mounting advantages. FIG. 5 illustrates the lid 32 without transparency, which shows the compactness of the enclosure 20 when integrated into the frame 14.

[0039] Turning now to FIG. 6, it has also been recognized that with the enclosure 20 integrated into the frame 14 as shown herein, one or more status lights 40 or other visual indicators or interaction components can be conveniently integrated into the frame 14 as well. This is an advantage from having electronics integrated into the frame 14, since the electronics are proximal to the frame's exterior thus allowing for a light 40 (e.g., an LED) to be visible from the exterior of the frame 14 when the solar panel 10 is installed. This also facilitates operation and maintenance of units in the field. It can be appreciated that any one or more lights 40 can be integrated into the frame 14, as well as buttons, or other interactive components. This can be achieved using any of the faces of the frame 14 and lid 32.

[0040] The light 40 can be placed in various positions, depending on the type of solar panel 10 and how it may be installed. For example, in some applications, the light 40 can be visible along an edge of the frame 14. In other applications, the light 40 can be visible on multiple faces. The light 40 can also be incorporated such that it is visible from the front of the solar panel 14 (i.e. the surface facing the source of illumination), which would be particularly advantageous in applications such as that shown in FIG. 1 B. Similarly, the light 40 can be integrated such that it is visible from the back of the solar panel 10, which can be useful in applications such as that shown in FIG. 1 A.

[0041] Turning now to FIG. 7, in which an enclosure 200 is provided wherein the frame 202 is modified to provide a proximate sidewall 206 and a distal sidewall 208 that support a lid 204 to define a cavity 210. The cavity 210 houses a circuit board 212 for electronics and the circuit board components 214 extending from or otherwise support thereon. The output cable 216 can extend through the lid 204 and a connection 218 be provided between the circuit board components 214 and the busbar 120 for the PV panel. This configuration advantageously provides the frame 202 as a good heatsink for the electronics, and the frame 202 or a portion thereof can be made to accommodate the height of the components 214. Moreover, the circuit board 212 (i.e. its length) can be sized according to the width of the frame 202. This configuration also eliminates the junction box enclosure since the electronics are contained within the frame 202. The advantages should also be weighed against the limits to the potential limitation to the width of the circuit board 212 based on the height of the frame 202.

[0042] FIG. 8 illustrates yet another enclosure configuration 300 in which the frame 302 supports an enclosure lid 304 on the outside of the frame 302. The lid 304 includes the proximal and distal sidewalls 306, 308 that together define a cavity 310 for containing the circuit board 312 and components 314. As before, the output cable 316 can extend through the lid 304, and a connection 318 provided between the circuit board 312 and busbar 120 of the PV panel. In this configuration, the frame 302 acts as a heat spreader as opposed to a heat sink. Also, the height of the components 314 and thus the overall height of the lid 304 will impact the overall panel size since the lid 304 is added onto the exterior of the frame 302. The length and width of the circuit board 312 are also dictated by the width and height of the frame 302. However, the externally placed lid 304 provides for ease of access and serviceability and is well suited for bifacial designs. Moreover, this configuration as depicted can eliminate the need for a separate junction box enclosure, and optionally part or all of the electronics can be flipped to the lid if rotated 180 ^° for improved thermal characteristics using similar methods as depicted in FIG. 12 (described below), which may or may not be more difficult in assembly. It can be appreciated that while normally the busbars connect to the junction box, in the configuration shown in FIG. 8, the connections come directly to the electronics, which would incorporate the functionality of the junction box as well as any other functionality it is meant to have, such as inverting to AC if a micro inverter is being used. The connections 318 in this example would need to be fed through the frame 302, which is conductive, without shorting the connections 318.

[0043] FIGS. 9 and 10 show further configurations 400, 400' in which the frame 402 extends parallel to the laminate 25 to provide a supporting surface for a lid 404. In the configuration shown in FIG. 9, the lid 404 is easily removed for serviceability similar to FIG. 8. In this case the frame acts as both a heat spreader and then a heat sink as heat moves laterally from the electronics. FIG. 10 shows the inverse application, wherein the electronics are mounted on the surface of the lip of a more conventional frame style. It may be noted that some pre-assembly may be required for this option and both these methods require either insulation in the busbar-through-frame passage or use of non-conductive frame material other than standard Aluminium grades typically for solar panel frames.

[0044] Turning now to FIG. 1 1 , yet another enclosure configuration 500 is shown, which is similar to the configuration 300 shown in FIG. 8 but with the lid 504 being secured to the frame 502 such that access to the electronics is from the rear. In this configuration, the frame 502 is modified to include an end support wall 506 and a sidewall 508 that enable the lid 504 to enclose a cavity 510 within which the circuit board 512 and components 514 are enclosed. The end wall 506 provides a heatsink for the electronics which is offset from the PV panel, the lid 504 enables ease of access and serviceability, and the configuration is well suited for bifacial designs. These advantages should be weighed against the size limitations dictated by the width and height of the frame 502 as well as the increased size of the PV panel.

[0045] FIG. 12 illustrates another configuration for housing electronics, in which a junction box enclosure 100 is used. The view shown in FIG. 12 is the same as that shown in FIG. 2, but with output connector cables 102 extending from the enclosure rather than to an in-frame enclosure. The junction box enclosure 100 is shown schematically in profile in FIG. 13. It may be noted that in the configuration shown in FIG. 12, several relatively expensive connectors, cables, and an electronics enclosure may be eliminated or reduced by integrating the electronics into a junction box.

[0046] As shown in FIG. 13, in this configuration a top lid enclosure 104 is secured to a bottom enclosure 106 to contain the junction box and other electronics. The bottom enclosure 106 is secured to the back of the laminate 25 with the top lid enclosure 104 containing electronic components that are secured to each other when the enclosure is assembled. In this example, the top lid enclosure 106 contains a circuit board 108 for electronics with an upper component 1 10 that mates with a lower component 1 14 in the bottom enclosure 106. For example an upper connection mechanism 1 12 can be used to be secured to a lower connection mechanism 1 16 on the lower component 114. This enables the circuit board 108 to be connected to the busbar 120 from the PV panel via one or more connections 1 18. As shown in this example, all of the normal junction box electronics as well as any special electronics for the particular application may be contained in the top lid 104 and be readily and easily assembled if the lid subassembly 104 is ready for the panel manufacturer. It may be appreciated that any combination of electronics may be split between the two enclosure subassemblies 104 and 106 in ways that lead to performance and assembly advantages for each individually and/or in combination. [0047] The configuration shown in FIG. 13 provides an advantageous thermal option by placing the electronics as thermally connected to the top lid enclosure 104. Moreover, the top lid enclosure 104 can be easily removed for serviceability, and eliminates the need for multiple enclosures. Furthermore, by having the electronics and junction box contained in an enclosure 100 that is separate from the frame 14, the footprint of the enclosure 100 (i.e. the length and width) are only limited by the size on the laminate 25 supported by the frame 14. These advantages should, however, be weighed against the proximity of heat being generated to the panel, and that the weight of the components are to be supported on, for example, a backsheet that is held by sealant. Also, since the enclosure 100 is secured to the rear of the laminate 25, the profile or height of the enclosure would be limited by the size of the frame 14. For example, a 50 mm frame may limit the enclosure 100 to having an assembled height of 40 mm, or a 36 mm frame may limit the enclosure to having an assembled height of 25 mm, etc., depending on the width of the laminate and other factors.

[0048] For simplicity and clarity of illustration, where considered appropriate, reference numerals may be repeated among the figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the examples described herein. However, it will be understood by those of ordinary skill in the art that the examples described herein may be practiced without these specific details. In other instances, well-known methods, procedures and components have not been described in detail so as not to obscure the examples described herein. Also, the description is not to be considered as limiting the scope of the examples described herein.

[0049] It will be appreciated that the examples and corresponding diagrams used herein are for illustrative purposes only. Different configurations and terminology can be used without departing from the principles expressed herein. For instance, components and modules can be added, deleted, modified, or arranged with differing connections without departing from these principles.

[0050] The steps or operations in the flow charts and diagrams described herein are just for example. There may be many variations to these steps or operations without departing from the principles discussed above. For instance, the steps may be performed in a differing order, or steps may be added, deleted, or modified.

[0051] Although the above principles have been described with reference to certain specific examples, various modifications thereof will be apparent to those skilled in the art as outlined in the appended claims.