Title:
IN-MOLD COATING COMPOSITION AND IN-MOLD-COATED MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2010/067851
Kind Code:
A1
Abstract:
Provided are an in-mold coating composition with excellent adhesiveness to a thermosetting molding resin or a thermoplastic molding resin, and a molded product effectively coated with a conductive coat inside a mold. Disclosed is an in-mold coating composition that contains (A) at least one kind selected from a urethane oligomer having a (meth)acryloyl group, an epoxy oligomer, a polyester oligomer, a polyether oligomer, or an unsaturated polyester resin, (B) a monomer that is copolymerizable with the component (A, C) conductive particles wherein the surfaces of organic particles are coated with conductive metal oxide particles, and (D) an organic peroxide polymerization initiator. The mass ratio between the component (A) and the component (B) is (A)/(B) = 20/80‑80/20, the mass ratio of the component (C) is (C)/{(A) + (B)} = 5/100‑50/100, and the mass ratio of the component (D) is (D)/{(A) + (B)} = 0.1/100 – 5/100. Also disclosed is an in-mold-coated molded product utilizing the composition.
Inventors:
OOTA KENJI (JP)
SHIROZA SHINICHIROU (JP)
YONEMOCHI KENJI (JP)
SHIROZA SHINICHIROU (JP)
YONEMOCHI KENJI (JP)
Application Number:
PCT/JP2009/070709
Publication Date:
June 17, 2010
Filing Date:
December 10, 2009
Export Citation:
Assignee:
DAINIPPON TORYO KK (JP)
OOTA KENJI (JP)
SHIROZA SHINICHIROU (JP)
YONEMOCHI KENJI (JP)
OOTA KENJI (JP)
SHIROZA SHINICHIROU (JP)
YONEMOCHI KENJI (JP)
International Classes:
C08F283/01; C08F290/06; C09D4/00; C09D5/24; C09D7/62; C09D163/00; C09D167/07; C09D171/00; C09D175/16; C08F2/44
Foreign References:
| JP2009051124A | 2009-03-12 | |||
| JP2006257368A | 2006-09-28 | |||
| JP2003301018A | 2003-10-21 | |||
| JPS60212467A | 1985-10-24 | |||
| JPH04226116A | 1992-08-14 | |||
| JPH06320681A | 1994-11-22 | |||
| JP2004075735A | 2004-03-11 | |||
| JP2004217872A | 2004-08-05 | |||
| JP2004262988A | 2004-09-24 | |||
| JP2005171024A | 2005-06-30 | |||
| JP2006232884A | 2006-09-07 | |||
| JPH0559291B2 | 1993-08-30 | |||
| JPS61273921A | 1986-12-04 |
Other References:
See also references of EP 2374826A4
Attorney, Agent or Firm:
YAMASHITA, Johei et al. (JP)
Jouhei Yamashita (JP)
Jouhei Yamashita (JP)
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