Title:
IN-VEHICLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/224537
Kind Code:
A1
Abstract:
An in-vehicle device includes a circuit board (4) on which a heat-generating component (electronic component (5)) is mounted, a first enclosure (base member (1)) facing the heat-generating part, and a thermally conductive material (6) filled in between the heat-generating component and the first enclosure. The first enclosure has a first enclosing portion (7) and a second enclosing portion (8). The first enclosing portion (7) is formed on an inner side of a region (1R) of the first enclosure that overlaps with the heat-generating part across the thermally conductive material (6), and surrounds a point (1C) in the region (1R) of the first enclosure facing the center of the heat-generating part. The second enclosing portion (8) is formed on an outer side of the region (1R) of the first enclosure, and surrounds the first enclosing portion (7).
Inventors:
WATANABE KIMIHITO (JP)
HOSHIYA NAOKI (JP)
HOSHIYA NAOKI (JP)
Application Number:
PCT/JP2022/004081
Publication Date:
October 27, 2022
Filing Date:
February 02, 2022
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H01L23/36; B60R16/02; H01L23/04; H05K7/20
Foreign References:
| JP2015088629A | 2015-05-07 | |||
| JP2007258430A | 2007-10-04 | |||
| JP2007234781A | 2007-09-13 | |||
| US20010026957A1 | 2001-10-04 | |||
| JP2013115083A | 2013-06-10 |
Attorney, Agent or Firm:
KAICHI IP (JP)
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