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Patent Searching and Data


Title:
INDUCTION-HEATED SOLDERING AUTOMATION EQUIPMENT
Document Type and Number:
WIPO Patent Application WO/2023/128271
Kind Code:
A1
Abstract:
The present invention relates to induction-heated soldering automation equipment and, particularly, to equipment comprising: a jig unit for fixing a substrate on which an electronic element is mounted; a first conveyor for transferring the jig unit; an induction heating unit which is provided above the jig unit so as to be movable in the X-axis, Y-axis, and Z-axis directions, and which includes a magnetic induction coil for soldering the electronic element by induction-heating the substrate fixed to the jig unit; and a controller for controlling the first conveyor and the induction heating unit, wherein continuously supplied molded interconnected devices (MIDs), PCBs, or FPCBs are locally heated through contactless induction heating so that electronic elements can be automatically soldered in a state in which thermal damage is minimized.

Inventors:
KIM JUN SIK (KR)
KIM YOUNG DO (KR)
CHOI JUNG SIK (KR)
JUNG TAE KYOUNG (KR)
KIM SEUNG HO (KR)
PARK IN HO (KR)
Application Number:
PCT/KR2022/018088
Publication Date:
July 06, 2023
Filing Date:
November 16, 2022
Export Citation:
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Assignee:
BS TECHNICS CO LTD (KR)
International Classes:
H05K13/04; B23K3/047; H05K13/00
Foreign References:
KR20100052236A2010-05-19
JPH09283916A1997-10-31
JP6272346B22018-01-31
CN103008950A2013-04-03
JP2009124066A2009-06-04
Attorney, Agent or Firm:
KIM, Jeong Hyeon (KR)
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