Technical Field

The present invention relates to mounting a computer in industrial apparatus, such as an industrial monitoring device or apparatus. In particular, the present invention relates to an apparatus and methods for mounting or integrating a computer into an industrial apparatus with strict environmental constraints, such as industrial monitoring equipment that is mounted close to an industrial process.

Background

Equipment mounted in or close to industrial processes often experience harsh environments which may include noise, heat and/or moisture. When equipment in such environments is desired to have significant computing power, such as for processing raw data from a sensing or monitoring device, there are a number of options for how this is provided. The sensing or monitoring device may, for example, be a spectrometer collecting data in real-time on constituents of a process. Conventionally, the raw data may be output from the device via a variety of serial communication methods, such as USB, to a control computer which may be a traditional ‘standalone’ tower computer. In general, it is undesirable to locate the control computer next to the sensing or analysis device because there may be limited space next to the process or the environment may not be suitable for locating the control computer. In such cases, the control computer may be located in a safe location away from corrosive, explosive or harmful substances. However, USB connections are only suitable for limited distances. Fibre-optic connections are more suitable for such connections, but are more costly and require additional components to, for example, convert from USB to optical-fibre.

In some circumstances it may be desirable to integrate, or embed, the computing resource into the sensing or monitoring apparatus. For example, if the amount of data and amount of processing required are large but once processed the output information has a smaller data size. Traditional cooling or temperature control techniques mount a computer in a vented case with active air-cooling. For example, a processor and/or other computing components may be cooled by a fan blowing air over the processor and/or components, or across a heatsink to control temperatures. Holes in the case allow the air to be vented from the housing to cool the computer.

Figure 1 is a schematic diagram of an industrial monitoring apparatus 20 coupled to a process 10. The components of the industrial monitoring apparatus are shown. The apparatus is coupled to the process via probe 26. Information and/or signals collected by the probe are processed by analysis equipment 22 to produce raw data. The raw data is converted to calibrated or normalized data at 24. Computer 28 processes the data in such a way that requires significant processing power to produce an output. The output may be transmitted 38 from the apparatus over a connection to a remote apparatus or control room. The components 24 and 28 may be combined into one processing system or computer. As shown in figure 1 the computer includes a heatsink 32 and a fan 34 which blows air across the heatsink. The air may be vented 35 from the apparatus through holes in the housing, and ambient air may be drawn in through other vents or holes in the housing. An additional fan (not shown) may be included at the vent to assist removal of heated air from the housing. The computer is mounted to the housing in the same way as computer components are mounted in a conventional PC such as by using standoff screws. Additional components are mounted to the housing or may be mounted in a separate portion of the housing.

Harsh industrial environments may comprise hazardous areas such as with an explosive atmosphere. Equipment may also be exposed to rough handling and/or vibration. For these reasons equipment manufactured for use in industrial systems is often required to be more robust than conventional or consumer equipment. For hazardous and explosive environments such as those defined by Ell Directive 2014/34/EU “ATEX” or IEC 60079 etc., equipment for those areas may require a level of ingress protection against dust, water and/or air. Equipment that is potentially subject to rough handling or high levels of vibration may be required to have a low number of, or zero, moving parts. These factors result in traditional methods of mounting computers in equipment being unsuitable for such environments. For example, rough handing or high vibration environments could result in detachment of computer components and, hence, damage within the equipment could result.

Accordingly, it is desirable to provide an arrangement for mounting a computer in industrial monitoring equipment that addresses these problems. It is also desirable that the mounting arrangement provides for convenient removal for testing and replacement of the computer in the industrial equipment.

Summary of the Invention

The present invention provides an industrial monitoring apparatus, comprising: a housing having walls, a top and a base; a computer assembly arranged in the housing, the computer assembly, when in use, being conductively cooled, the computer assembly comprising: a computer comprising a processor and memory mounted to a circuit board; a dual-function carrier, wherein the computer is mounted to the dual-function carrier and the dual-function carrier is coupled inside the housing to one of the walls, the top or the base of the housing, and wherein the dual-function carrier provides, in use, thermal heatsinking of heat generated from the processor to the respective one of the walls, top or base of the housing, and wherein at least part of the housing is openable and the computer assembly is removable from the housing. The apparatus may be a device or a unit, and the housing may be a casing or box. The arrangement of mounting the dual-function carrier at the wall, base or top of the housing provides a thermal path from the computer to the housing. Heat generated by the computer may be conducted to the housing where it is dissipated to the surroundings. The dual-function carrier may be a plate or a slim machined block, and is preferably metal such as aluminium. The dual-function carrier may also be known as a thermal or heatsinking carrier, or a removable carrier, because of its dual functionality.

The dual-function carrier may be coupled or mounted to one of the walls of the housing. The top of the housing may be openable or removable, such as forming a lid. Alternatively, any of the walls or base may be openable or removable. By openable or removable we mean for servicing or maintenance of the computer and any other components mounted with the housing.

The dual-function carrier may be mounted parallel to the respective one of the walls, top or base of the housing, for example, to provide a close fit. The dual-function carrier may be in contact with the housing to provide a good thermal path to the housing. For example, there should be no air-gap between the carrier and housing.

The computer may comprise additional components that are not mounted to the circuit board, wherein the additional components are mounted on the dual-function carrier so as to be commonly removable from the housing with the computer. By mounting the additional components to the dual-function carrier the computer may be removed as a module or single unit and tested, serviced or repaired outside of the housing.

The computer may be configured for conductive cooling without a fan in the housing. That is, there may be no fan on the computer assembly or anywhere else in the housing. In operation heat from the computer is conducted away to the housing for dissipation to the surroundings.

The dual-function carrier may be coupled to one of the walls, the top or the base of the housing, and the apparatus may further comprise a chassis layer between the respective one of the walls, the top or base and the dual-function carrier. The dual-function carrier may be mounted to the chassis layer. If a chassis layer is used, again to provide a good thermal path to sink heat away from the computer, there should not be air-gaps between the carrier and chassis layer or between the chassis layer and the housing.

The computer may have an integrated heatsink in contact with the dual-function carrier to provide heatsinking from the computer.

The dual-function carrier may comprise one or more slots. The dual-function carrier may be coupled to the chassis or housing with fasteners and one or more of the fasteners may be received in the slots. The one or more slots and one or more fasteners may be arranged such that the dual-function carrier is slidably removable from being coupled to the one of the walls, top or base by loosening of the one or more fasteners. At least some of the fasteners may not be required to be removed to allow the dual-function carrier to be slidably removed.

The computer may comprise a battery mounted to the dual-function carrier, and the battery may be commonly removable with the dual-function carrier from the housing.

The dual-function carrier may comprise a recess into which the battery is received. The dual-function carrier may further comprise a clip for holding the battery in the recess.

The apparatus may further comprise an infrared spectrometer such as for monitoring an industrial process, and the infrared spectrometer is mounted in the housing.

The computer may be a single board computer or a circuit board having all of its core operating components rigidly attached to it.

The dual-function carrier may comprise one or more raised platforms for contacting one or more integrated heatsinks of the computer.

The dual-function carrier, housing and, optionally, the integrated heatsink, provide a thermal path to conduct heat from the computer to the housing which is then dissipated to the surroundings. The thermal path is provided by contact between the dual-function carrier, housing and optionally the integrated heatsink. A chassis layer may also be included between the dual-function carrier and housing and also contributing to thermal path. Preferably, thermal contact is provided by planar contact respectively between the dual-function carrier and the one of the walls, base or top to which the carrier is coupled or mounted. Optionally, the dual-function carrier is mounted parallel to the one of the walls, base or top, with a thermal interface material, such as thermal grease or paste, between the dual-function carrier and the one of the walls, base or top. If included, the chassis layer is provided between the dual function carrier and the respective one of the walls, base or top, and in such a case planar contact or parallel mounting with a thermal interface material, such as thermal paste or grease, is made at the interfaces between dual-function carrier, housing wall, base or top and chassis layer. Optionally, the computer comprises an integrated heatsink, and in such a case planar contact or parallel mounting with a thermal interface material, such as thermal paste or grease, is made at the interface between the dual-function carrier and integrated heatsink. By planar contact we mean that the contacting surface are planar and there is contact across the planes of the respective parts.

The present invention further provides a method of mounting a computer in a housing of an industrial monitoring apparatus, the method comprising: mounting a computer to a dual-function carrier to form a computer assembly, the computer comprising a processor and memory mounted to a circuit board; inserting the computer assembly into the industrial monitoring apparatus; coupling the dual-function carrier inside the housing to one of the walls, base or top of the housing of the industrial monitoring apparatus; connecting the computer to sensing or analysis components in the apparatus; and closing the housing. Closing the housing may comprise closing a door or panel in the walls, base or top, for example closing a lid.

The method may further comprise mounting additional computer components to the dual-function carrier before inserting the computer assembly into the industrial monitoring apparatus. The additional component may be a battery such as a CMOS battery, and mounting may comprise inserting the battery in a recess in the dual-function carrier and securing the battery with a fastener.

The step of inserting may comprise sliding the computer assembly into a mounting position in the housing by manoeuvring slots in the dual-function carrier to engage with fasteners.

The present invention further provides a method of maintenance of a computer in an industrial monitoring apparatus, the method comprising: opening a housing of the industrial monitoring apparatus; disconnecting a computer from sensing or analysis components in the apparatus; decoupling a dual-function carrier from one of the walls, base or top of the inside of the housing, the dual-function carrier and computer forming a computer assembly; removing the computer assembly from the industrial monitoring apparatus; and outside of the housing: testing the computer, replacing components of the computer and/or servicing the computer. Opening a housing may comprise opening a door or panel in the walls, base or top, for example opening a lid.

The present invention further provides an industrial monitoring apparatus, comprising: a housing having walls, a top and a base; a computer assembly arranged in the housing, the computer assembly arranged to be conductively cooled and comprising: a computer comprising a processor and memory mounted to a circuit board; a dual-function carrier, wherein the computer is mounted to the dual-function carrier and the dual-function carrier is coupled inside the housing to one of the walls, the top or the base of the housing, and wherein the dual-function carrier provides, in use, thermal heatsinking of heat generated from the processor to the respective one of the walls, top or base of the housing.

The present invention further provides a computer assembly for mounting in a housing of an industrial monitoring apparatus, the computer assembly comprising: a processor and memory mounted to a circuit board, and a dual-function carrier, wherein the computer is mounted to the dual-function carrier and the dual-function carrier provides, in use, when mounted to a housing, thermal heatsinking of heat generated from the processor to the housing.

Brief Description of the Drawings

Embodiments of the present invention, along with aspects of the prior art, will now be described with reference to the accompanying drawings, of which: figure 1 is a schematic diagram of a prior art apparatus with a computer cooled by a fan and vented to the surroundings; figure 2 is a schematic diagram of a conductively cooled process monitoring apparatus according to an embodiment of the invention; figures 3A and 3B are respectively a top plan view and side cross-section view of an industrial process monitoring apparatus according to an embodiment of the present invention; figure 4 is a perspective view of the industrial process monitoring apparatus of figures 3A and 3 B; figure 5 is a view of the computer assembly mounted to the housing; figures 6A and 6B are respectively perspective views of an embodiment of the dual function carrier without and with the computer mounted thereto; figure 7 is a perspective view of the rear of the dual-function carrier; figure 8 is a flow diagram of the process of mounting a computer in the industrial monitoring apparatus; and figure 9 is a flow diagram of performing maintenance on the computer including removing it from the industrial monitoring apparatus.

Detailed Description

Figure 2 shows an industrial monitoring apparatus 100 according to the present invention coupled to a process 10. Reference numbers in figure 2 that are the same as reference numbers in figure 1 indicate corresponding or similar features. In figure 2 at least the computer 28, heatsink 132 and housing 102 are different to those of figure 1. The computer 28 comprises a processor and memory arranged on a circuit board such as a motherboard. The computer, for example the processor, may have an integrated heatsink. The integrated heatsink is in thermal contact with the heatsink 132 which in turn is in thermal contact with the housing 102, such as the walls of the housing. Thermal interface material, such as thermal grease or paste, may be used between the integrated heatsink of the computer and heatsink 132, and also between heatsink 132 and the housing 102. The housing is relatively robust and made of a high thermal conductivity material. The robustness of the housing also means the housing has a high thermal capacity for absorbing and carrying away heat from the computer to transfer it to its surroundings.

Figures 3A, 3B and 4 show a more detailed embodiment of an industrial monitoring apparatus of the present invention. The probe 26 is not shown. Figure 3A is a plan view from above of the industrial monitoring apparatus. Figure 3B is a cross-sectional view through the apparatus, taken along the line X-X in figure 3A. Figure 4 is a perspective view of the apparatus. In figures 3A, 3B and 4 to improve clarity the top or lid of the apparatus is not shown.

The industrial monitoring apparatus comprises a housing which is made of walls 210, a base and a top. The walls, base and top surround the components in the apparatus. As shown in figures 3A and 3B there are three regions marked with hashed shading and labelled A, B and C. These areas represent components or subassemblies in the apparatus which it was required to work around. The areas A, B and C are not shown in figure 4 to avoid obscuring features of the figure. In one embodiment, the apparatus is an infrared spectrometer and one of the areas such as area A may be the interferometer of the spectrometer. However, this is just an example. Areas B and C may be circuit boards, interfaces, network interface cards and/or other components. Hence, in the apparatus shown there were significant limitations on the amount of space available for incorporating a computer. The limited space also significantly limits access for mounting and fixing the computer into the housing. Along one wall there is space 220 and this is where the computer 228 is located. As shown, the housing comprises, at the top of the walls, a lip with holes 238. The holes are arranged to receive fasteners which are used to attach and secure the top to complete the housing or box. Hence, the top may be considered to be a lid and is openable or removable. In other embodiments, other panels of the housing may be openable or removable to allow access to the interior of the apparatus. For example, any of the walls or base, or part thereof, may be openable. We now describe the mounting of computer 228. The computer is preferably a single board computer (SBC) or single board industrial computer. This means that the SBC is a complete computer built on a single circuit board and includes processor(s) 234, memory, input/output (I/O) features and other features for the essential functioning of a computer. As an SBC, it is likely to include only limited expansion capability but may allow for the addition of extra memory such as by m.2, mSATA or USB connection. The processor and/or other features of the computer may have a heat-sink integrated thereto.

The computer 228 is mounted to a dual-function carrier 232. The dual-function carrier is also known as a dual-use or heat-sinking carrier. This is because it performs two functions, namely those of sinking away heat from the computer 228 and also providing a mount on to which the computer and related components can be commonly assembled. That is, the dual-function carrier 232 is configured for mounting the computer and other components for the computer such that the combination of computer, other components and dual-function carrier 232 together form a computer subassembly that may be removed as whole for testing and replacement. The dual-function carrier 232 may be a plate or more preferably is a thin machined block with recess and/or platforms for receiving and contacting parts of the computer. For example, the dual-function carrier may have a surface that abuts against the integrated heatsink of the processor 234 such that the two have surfaces in planar contact with each other to provide a good thermal path from the processor to the carrier. Alternatively, a thermal interface material (TIM) may be used between the integrated heatsink of the processor (or other component) and the dualfunction carrier, for example, thermal paste, a thermal pad, or a liquid-state metal alloy. The recesses or platforms may be provided to allow good thermal contact to be made to the processor heatsink and other components. An example platform 252 is shown in figure 6A. The carrier may be attached to the wall of the housing. Again good planar contact with the wall of the housing is preferred so as to provide a good thermal path from the carrier to the housing. The housing and dual-function carrier are made of a high thermal conductivity material such as a metal. Preferably, the housing is made of cast aluminium and the walls and base form a single casting. The dual-function carrier is preferably made of aluminium.

In the embodiment of figures 3A, 3B and 4, between the carrier 232 and the wall of the housing 210 is a chassis. The chassis is formed of chassis plates 240a, 240b, which are in contact with the housing. Chassis plates are provided along each of the internal walls of the housing. The chassis allows multiple components to be fitted inside the housing without requiring a large number of mounting holes or fixtures to be provided in the walls of the housing. The chassis-plates may be fixed to the walls with fasteners such as screws or bolts. Alternatively, the chassis plates may interlock and/or have a sprung or interference fit in the housing. A combination of these and other methods of mounting the chassis in the housing are also possible. Access to the inside walls of the housing, such as for drilling, is limited because the housing walls and base are formed as a single cast unit. For a monitoring device that is required to meet safety standards for explosive environments it is preferable not to machine or drill into the walls of the housing, Hence, for such units a sprung or interference fit is desirable. The chassis plates are easily removable and can be drilled or machined in other ways to include holes or fixtures for having components and circuits attached, thereby avoiding or minimizing the number of holes required to be drilled into the housing. The chassis plates are preferably made of aluminium.

The chassis plate 240a to which the dual-function carrier 232 is mounted is required to have good planar contact with the wall 210 such that there is a good thermal path to the housing 210.

In one embodiment, the chassis is formed of folded sheet metal comprising a base attached to four sides. The sides are folded with a slight angle so that they act as a spring as it is lowered into the housing 210. Once in the housing, the chassis is screwed to the bottom of the enclosure. Further screws fastened through tabs in the top corners of the chassis plates push the top corners of the plates against the wall of the housing. Thermal grease or paste may be used between the chassis and housing walls but sufficient contact may be made with the sprung arrangement of plates alone.

Figure 5 is a more detailed side-view of the computer assembly comprising the dual-function carrier 232 and computer 228. Figure 6A and 6B are perspective views respectively of the dual-function carrier without the computer 228 attached to it and with the computer and other components attached to it. The dual-function carrier 232 is shown with the computer attached above it. Pillars or standoffs 250 are used to space the fastening point of the circuit board of the computer 228 from the face of the dual-function carrier. The pillars or standoffs may be machined into the carrier or may be a separate item. The dualfunction carrier additionally has platforms or protrusions 252 on its top face. The pillars or standoffs mount the computer board at the correct height for the desired components to contact the platform(s) for heatsinking. For example, one of the platforms contacts the integrated heatsink of the processor 234.

Figures 5 and 6A also show a recess 254 provided for receiving a further component 236 of the computer that is not provided on the circuit board. This component may be a battery such as a CMOS battery. Also provided, as shown in figure 5, is a spring clip 256 for holding the battery in position in the recess and maintaining required electrical contacts. In general, other components for the computer that are not provided on the circuit board such as the circuit board of single board computer may be mounted to the dualfunction carrier in this way. The dual-function carrier in combination with the computer and other components attached to it provide a self-contained computer assembly that may be removed from the housing by releasing the fasteners holding the dual-function carrier in place in the housing. As a result, instead of having to separately detach each component of the computer from the housing, such as by undoing screws or releasing fasteners, all that is required is to release or undo the fasteners holding the computer assembly in the housing.

In more detail, the CMOS battery is mounted into the dual-function carrier in a recess. The battery is held in the recess with the spring clip 256. This spring clip 256 is fastened to the dual-function carrier using a single screw and wedge-lock washer, located such that it does not obstruct access to screws or fasteners used to mount the computer assembly into the housing. The spring clip screw does not pass through to the housing, meaning the dual-function carrier may be removed, with the spring clip and CMOS battery, as a module. The use of a single carrier to mount the computer 228 together with all its additional components enables the assembly to be removed from the apparatus and replaced or serviced without the need to remove any other components.

Figure 7 is a perspective view of the rear of the dual-function carrier 232, that is, the opposite side to that shown in figure 6A. The dual-function carrier may be mounted to the housing or chassis by screws or bolts. For example, two or four screws may be used. The screws are accessible only from the inside of the housing. The screws may be fitted with wedge-lock washers. The wedge-lock washers maintain the screws or bolts tight such that good thermal contact remains even if the apparatus is subjected to vibrations over a sustained period.

In the case where the dual-function carrier is fitted with four screws, some of these screws may pass through slots in the dual-function carrier instead of through circular through-holes. This enables the dual-function carrier and thus the computer assembly to be removed without fully removing these screws. The screws can then be used as alignment features when re-fitting the computer assembly or a fitting a replacement assembly. This arrangement is shown in figure 7 where two slots and two holes can be seen. Slots and holes may also include a recess for receiving the screw or bolt head. The screw holes may also be offset from each other.

The arrangement of slots and holes and the dual-function carrier contribute to providing relatively easy mounting of the computer in the limited space available in the housing. For example, as can be seen in figures 3A and 3B there is limited space available for mounting the computer in the housing. The dual-function carrier is mounted substantially vertically against one of the walls of the housing to avoid hitting the components represented by area A in the figures. The two slots of the carrier allow the bolts or screws that hold the lower end of the carrier to be preinstalled into the wall which then allow the carrier to slot or hook onto the bolts of screws as it is lowered into position in the housing. Elongated recesses for the bolts are also provided to allow manoeuvring of the carrier in to position at an angle before pushing it vertical and securing it.

In an alternative arrangement the dual-function carrier may be attached in the housing with only two screws or bolts. The other two screws may be replaced by a pair of spring clips, again fitted with wedge-lock washers, to improve accessibility and make it easier to remove the dual-function carrier from the housing.

In the preceding arrangements we have discussed mounting of the carrier to the housing, however we alternatively mean that the carrier is attached to the chassis in the housing.

The housing of the monitoring apparatus is relatively robust to provide protection of sensitive components inside, which may for example include a spectrometer. The housing therefore has a significant mass and also a relatively high thermal capacity. The housing is preferably made of metal such as aluminium. Hence, the housing also has a high coefficient of thermal conductivity. The combination of these factors and also a large surface area means that it performs well as a heatsink, passively cooled by surrounding air. The use of this conductive cooling mechanism removes the need for any convective cooling mechanisms such as a fan inside the housing This increases the reliability of the monitoring apparatus, decreases susceptibility to vibration, and reduces the amount of physical space required for the computer since no fan is required. An estimate of the heat capacity of the housing provides a capacity of around 10kJK ^-1 or more, such as around 12kJK ^-1 . This assumes the housing is aluminium and has a mass of greater than around 10kg, such as around 13kg. As a comparison, the monitoring apparatus including the computer consumes up to around 110W which is relatively small in comparison to the thermal capacity of the housing. These are just example heat capacities and power consumption figures. Other embodiments may consume more or less power and the heat capacity of the housing may be increased or decreased accordingly. For example, for increased power consumption, the heat capacity of the housing may be greater than the 10-12 kJK ^-1 mentioned. Testing of the apparatus at an ambient temperature of 57C has shown that the housing is cooled sufficiently without fans and the electronics in the housing are kept below their 80C maximum operating temperature.

Although we have described the dual-function carrier, housing and (where fitted) the chassis as being made of aluminium, other metals or materials may be used. Preferably, the metals or materials have a high coefficient of thermal conductivity, k, that is, one above around 100 Wm ^-1 K' ¹ .

We now return to figures 3A, 3B and 4 to describe further aspects of the monitoring apparatus. The computer 228 includes Ethernet ports for network connection and transmission of data from the apparatus. Ethernet cables are connected to the ports and the cables may be secured to the dual-function carrier to avoid them moving around. The Ethernet cables extend through the wall of the housing and can be seen as the cables passing through the wall towards the bottom of the right hand side in figure 3A. Ethernet cables are significantly cheaper than fibre optic cables. Compared to fibre-optic cables, problems with the connection using Ethernet cables are easier to diagnose, and Ethernet cables are widely available so can be replaced easily if damaged.

Furthermore, installing a single enclosed apparatus or unit with an Ethernet output is much easier for customers. Additionally, the output data has now been processed data, since the computer is integrated into the apparatus so can be interpreted more easily by the user. On top of this, users do not need to find a safe location to house a computer. Such space may be at a premium or non-existent in some customer locations. This advantage is especially large when considering customers who may have multiple monitoring apparatuses, for example, spectrometers, each needing a separate computer. The use of Ethernet also eliminates conversion to fibre-optic communications thereby removing components and complexity, and eliminating points of failure.

When the lid or other openable panel is attached, the housing may or may not be air-tight or water-tight. Preferably, where the housing is not air-tight, the housing is connected to a source of dry/oil-free air which is used as purge to remove water vapour and thereby maintain optimum operating conditions of the apparatus. Preferably, the housing is rated to IP65 and so is dust-tight and resistant to low pressure water jets.

We have previously described that no fan is provided to cool the computer 228. Instead it is conductively cooled by sinking the heat away to the housing 210. There is also preferably no fan provided elsewhere in the housing. The absence of a fan and other moving parts means improved resistance of the monitoring apparatus to vibration and impacts. As mentioned, in one embodiment the monitoring apparatus includes a spectrometer which is formed of optical components, such as mirrors, making up an interferometer. Some interferometers have moving parts, but a preferred embodiment uses a Sagnac design which has no moving parts and the optical paths are coincident. Such a design is inherently vibration-resistant. Accordingly, the lack of moving parts throughout the apparatus provides increased reliability.

The dual-function carrier sinks heat from the computer directly through to the wall of the housing of the monitoring apparatus. The directness of this heatsinking provides significant space savings.

In alternative embodiments the computer may be mounted to a different internal face of the housing. For example, the computer may be mounted to the underside of the top or to the inside base surface of the housing. As for the earlier described embodiments, the computer is mounted on a dual-function carrier and optionally to a chassis plate. The dual-function carrier provides a mount for the computer and any related additional components as set out in the preceding paragraphs such that together they form a removable assembly for servicing, replacement and testing. For mounting to a removable panel of the housing, such as a lid, this may provide easier access and greater physical space than mounting on a wall of the housing. However, mounting on the removable panel/lid has disadvantages because longer cables would be required which would require management to avoid being trapped when the panel is closed and such that they do not interfere with other components in the housing.

Figure 8 is a flow diagram of a method of mounting the computer in an industrial monitoring apparatus. At step 810 the computer is mounted to the dual-function carrier to form the computer assembly. The computer comprises a processor and memory mounted to a circuit board. At step 820 the computer assembly is inserted into the mounting space in the industrial monitoring apparatus. At step 830 the dual-function carrier is coupled or mounted to one of the walls, base or lid of the housing of the industrial monitoring apparatus. At step 840 the computer is connected to other components in the apparatus such as to sensing or analysis components. At step 850 the lid is closed and attached to the walls to close the housing. Additional computer components may be mounted to the dual-function carrier before inserting the computer assembly into the apparatus at step 820. The additional components may include a battery such as a CMOS battery, which may be mounted by inserting the battery in a recess in the dual-function carrier and securing the battery with a fastener. When inserting the computer assembly in to the housing it may need to be manoeuvred such that slots of the carrier slide on to fasteners. The opening or removable part of the housing may alternatively be a wall or base of the housing.

Figure 9 is a flow diagram of a method of maintenance of the computer in an industrial monitoring apparatus. At step 910 the housing of the industrial monitoring apparatus is opened, such as by opening the lid. At step 920 the computer is disconnected from other components in the apparatus such as from sensing or analysis components. At step 930 the dual-function carrier is demounted or decoupled from the one of the walls, base or top of the housing to which it is mounted. At step 940 the computer assembly is removed from the apparatus. At step 950, outside of the housing, testing the computer, replacing components of the computer and/or servicing the computer are performed.

The person skilled in the art will readily appreciate that various modifications and alterations may be made to the above described apparatus and methods. For example, different materials, mounting methods or relative positional configurations may be used. Furthermore, although the embodiments have been described in relation to the apparatus comprising a spectrometer, the methods described herein may be applied to many other industrial monitoring apparatus or the like.