Title:
INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/112830
Kind Code:
A1
Abstract:
An information processing device (5) comprises: an information acquisition unit (500) that acquires a polishing process condition including top ring state information, polishing table state information, and polishing fluid supply nozzle state information in a chemical mechanical polishing process carried out for a substrate by a substrate processing device comprising a polishing table that rotatably supports a polishing pad, a top ring that presses the substrate against the polishing pad, and a polishing fluid supply nozzle that supplies polishing fluid to the polishing pad; and a state prediction unit (501) that inputs the polishing process condition acquired by the information acquisition unit (500) into a learning model (10A) that has been trained by machine learning with a correlation between the polishing process condition and substrate state information indicating a state of the substrate having been subjected to the chemical mechanical polishing process under the polishing process condition, to thereby predict substrate state information for the substrate having been subjected to the chemical mechanical polishing process under the polishing process condition.
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Inventors:
TAKEBUCHI KENICHI (JP)
SAITO KENICHIRO (JP)
SAITO KENICHIRO (JP)
Application Number:
PCT/JP2022/045330
Publication Date:
June 22, 2023
Filing Date:
December 08, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/005; B24B37/00; B24B37/015; B24B37/30; B24B37/32; B24B49/10; B24B49/14; B24B49/16; B24B55/03; H01L21/304
Foreign References:
| JP2020053550A | 2020-04-02 | |||
| JP2021150474A | 2021-09-27 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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