Title:
INFORMATIONAL POLYMER FILM INSERT MOLDING
Document Type and Number:
WIPO Patent Application WO2003045673
Kind Code:
B1
Abstract:
A system and method for using a thin polymer film member 34 to bond indicia 36 in the molding process for manufacturing wafer containers 10 and other plastic articles for use in the semi-conductor manufacturing industry, and particularly such articles for use in semiconductor fabrication clean room environments. The system and method enables multicolored indicia and unique electronically readable indicia to be blonded to the article, while also providing a protective containment barrier to inhibit process contamination stemming from the indicia and to protect the indicia from physical damage.
Inventors:
BHATT SANJIV M (US)
EGGUM SHAWN D (US)
EGGUM SHAWN D (US)
Application Number:
PCT/US2002/037865
Publication Date:
July 10, 2003
Filing Date:
November 26, 2002
Export Citation:
Assignee:
ENTEGRIS INC (US)
BHATT SANJIV M (US)
EGGUM SHAWN D (US)
BHATT SANJIV M (US)
EGGUM SHAWN D (US)
International Classes:
B65D25/20; B29C37/00; B29C45/14; B29D99/00; B65D85/86; H01L21/673; B29K69/00; B29K105/20; B29K667/00; B29K671/00; (IPC1-7): B29D22/00; B29B13/00
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