Title:
INGOT CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/051668
Kind Code:
A1
Abstract:
This ingot cutting method is characterized in that an ingot is cut by setting, at the time of cutting a cut start portion of the ingot, a tensile force to be applied to a wire on the side fed out from a bobbin higher than a reference tensile force, and a tensile force to be applied to the wire on the side to be taken up by a bobbin lower than the reference tensile force, in the case where a tensile force to be applied to the wire on the side fed out from the bobbin at the time of cutting an ingot portion having the maximum diameter is set as the reference tensile force. Consequently, without deteriorating a wire breakage occurrence rate, wafers having less warpage can be cut out from the ingot.
Inventors:
KANBAYASHI KEIICHI (JP)
Application Number:
PCT/JP2015/004476
Publication Date:
April 07, 2016
Filing Date:
September 03, 2015
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B27/06; H01L21/304
Foreign References:
| JP2012000733A | 2012-01-05 | |||
| JP2008023644A | 2008-02-07 | |||
| JP2005153031A | 2005-06-16 | |||
| JPH0929607A | 1997-02-04 |
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
Good Miya Mikio (JP)
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