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Title:
INJECTION MOLDING APPARATUS AND INJECTION MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/065434
Kind Code:
A1
Abstract:
The invention relates to an injection molding apparatus and an injection molding method. The injection molding apparatus (10A) is provided with: a middle mold (20), which is disposed between a fixed mold (16) and a movable mold (22) and in which a through hole (52) that opens into both the fixed mold (16) and the movable mold (22) is formed; a first nozzle (36) for supplying the molten material into a first cavity (204a); a second nozzle (38) for supplying the molten material to a second cavity (204b); and a sealing member (68) capable of sliding on the wall surface configuring the through hole (52). The sealing member (68) is pushed to the side where the first mold (16) is positioned and is pressed against the second nozzle (38).

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Inventors:
KURAMITSU KAZUTAKA (JP)
IDE TORU (JP)
NAGAI HIROYA (JP)
OGUSHI AKIRA (JP)
Application Number:
PCT/JP2012/075308
Publication Date:
May 10, 2013
Filing Date:
October 01, 2012
Export Citation:
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Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
B29C45/26; B29C45/12
Foreign References:
JPS6181922U1986-05-30
JPH11207786A1999-08-03
JP2004249538A2004-09-09
JP2000000855A2000-01-07
Attorney, Agent or Firm:
CHIBA Yoshihiro et al. (JP)
Takehiro Chiba (JP)
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Claims:



 
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