Title:
INJECTION MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2005/068110
Kind Code:
A1
Abstract:
A device capable of injection molding a metal with a high melting point. The injection molding device has a metal mold (1), a sleeve (27) provided for advance toward and retreat from a downgate (4) of the metal mold, a plunger (33) slidably provided in the sleeve, heating means (37) for heating and melting a raw material block (A) supplied to a raw material receiving section formed by the inner wall of the sleeve and the plunger, and raw material block supplying means (47) for supplying the raw material block from the above to the raw material receiving section. The plunger and/or the sleeve are provided with cooling means for making a molten metal produced by heating and melting a metal to be hard to flow into a gap between the plunger and the sleeve.
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Inventors:
ISHIDA MAMORU (JP)
KAWANISHI MAKOTO (JP)
KAWANISHI MAKOTO (JP)
Application Number:
PCT/JP2005/000377
Publication Date:
July 28, 2005
Filing Date:
January 14, 2005
Export Citation:
Assignee:
YKK CORP (JP)
ISHIDA MAMORU (JP)
KAWANISHI MAKOTO (JP)
ISHIDA MAMORU (JP)
KAWANISHI MAKOTO (JP)
International Classes:
B22D17/12; B22D17/20; B22D17/30; B22D17/28; (IPC1-7): B22D17/28; B22D17/20; B22D17/30
Foreign References:
| JP2001246451A | 2001-09-11 | |||
| JPH1058108A | 1998-03-03 | |||
| JPH09164465A | 1997-06-24 | |||
| JPH11285801A | 1999-10-19 |
Attorney, Agent or Firm:
Yoshida, Shigeki (Harada Bldg. 14-2, Takadanobaba 2-chom, Shinjuku-ku Tokyo 75, JP)
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